H10P 72/0414
Using mainly spraying means
Official title: {using mainly spraying means, e.g. nozzles}
H10P72/0414 (Using mainly spraying means) appears on 3,289 US grants and 4,448 published applications in this corpus.
Search patents in H10P- Granted patents
- 3,289
- Published applications
- 4,448
- Assignees
- 572
- Inventors
- 5,730
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 2 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 2 | 0 |
| 1988 | 1 | 0 |
| 1989 | 5 | 0 |
| 1990 | 2 | 0 |
| 1991 | 4 | 0 |
| 1992 | 6 | 0 |
| 1993 | 5 | 0 |
| 1994 | 9 | 0 |
| 1995 | 5 | 0 |
| 1996 | 11 | 0 |
| 1997 | 20 | 0 |
| 1998 | 19 | 0 |
| 1999 | 53 | 0 |
| 2000 | 54 | 0 |
| 2001 | 58 | 27 |
| 2002 | 73 | 94 |
| 2003 | 86 | 118 |
| 2004 | 75 | 142 |
| 2005 | 65 | 116 |
| 2006 | 60 | 139 |
| 2007 | 68 | 179 |
| 2008 | 58 | 145 |
| 2009 | 54 | 157 |
| 2010 | 79 | 119 |
| 2011 | 106 | 110 |
| 2012 | 94 | 157 |
| 2013 | 91 | 144 |
| 2014 | 103 | 186 |
| 2015 | 110 | 166 |
| 2016 | 119 | 148 |
| 2017 | 170 | 195 |
| 2018 | 134 | 233 |
| 2019 | 150 | 216 |
| 2020 | 192 | 216 |
| 2021 | 173 | 218 |
| 2022 | 149 | 261 |
| 2023 | 202 | 283 |
| 2024 | 217 | 271 |
| 2025 | 231 | 233 |
| 2026 | 169 | 175 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Baffle inspection apparatus6 Oct 2026US 12,754,090 B2Samsung Electronics Co., Ltd.
- Wet cleaning tool and method6 Oct 2026US 12,757,668 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Systems and methods for recovering organic contaminants from semiconducting wafers29 Sep 2026US 12,749,667 B2Elemental Scientific, Inc.
- Spraying nozzle type of an apparatus for removing a residual gas on a wafer29 Sep 2026US 12,751,234 B2VM Inc.
- Apparatus and method for dispensing treatment liquid29 Sep 2026US 12,751,239 B2Semes Co., Ltd.
- Bowl assembly and substrate processing apparatus comprising the same8 Oct 2026US 2026/0307119 A1Samsung Electronics Co., Ltd.
- Semiconductor process system and method of cleaning the same8 Oct 2026US 2026/0308756 A1Samsung Electronics Co., Ltd.
- Substrate processing apparatus and substrate processing method8 Oct 2026US 2026/0314295 A1Ebara Corporation
- Substrate processing method and substrate processing apparatus8 Oct 2026US 2026/0314296 A1SCREEN Holdings Co., Ltd.
- Systems and methods for shuttered wafer cleaning8 Oct 2026US 2026/0314306 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Semiconductor device manufacturing system534US 6,212,789 B1Canon Sales Co., Inc. · 2001
- Continuous processing system for chemical mechanical polishing501US 5,738,574 AAPPLIED Materials.Inc. · 1998
- Substrate treatment method and substrate treatment apparatus473US 9,698,031 B2SCREEN Holdings Co., Ltd. · 2017
- Etchant mixing system for edge bevel removal of copper from silicon wafers407US 6,333,275 B1Novellus Systems, Inc. · 2001
- Electro-chemical deposition cell for face-up processing of single semiconductor substrates343US 6,416,647 B1APPLIED Materials.Inc. · 2002