H10D 88/00
Three-dimensional [3d] integrated devices
Official title: Three-dimensional [3D] integrated devices
H10D88/00 (Three-dimensional [3d] integrated devices) appears on 5,481 US grants and 6,699 published applications in this corpus.
Search patents in H10D- Granted patents
- 5,481
- Published applications
- 6,699
- Assignees
- 665
- Inventors
- 6,912
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 5 | 0 |
| 1978 | 6 | 0 |
| 1979 | 1 | 0 |
| 1980 | 8 | 0 |
| 1981 | 16 | 0 |
| 1982 | 4 | 0 |
| 1983 | 13 | 0 |
| 1984 | 20 | 0 |
| 1985 | 23 | 0 |
| 1986 | 21 | 0 |
| 1987 | 25 | 0 |
| 1988 | 16 | 0 |
| 1989 | 15 | 0 |
| 1990 | 24 | 0 |
| 1991 | 34 | 0 |
| 1992 | 31 | 0 |
| 1993 | 32 | 0 |
| 1994 | 37 | 0 |
| 1995 | 36 | 0 |
| 1996 | 32 | 0 |
| 1997 | 38 | 0 |
| 1998 | 45 | 0 |
| 1999 | 44 | 0 |
| 2000 | 53 | 0 |
| 2001 | 46 | 24 |
| 2002 | 52 | 58 |
| 2003 | 64 | 100 |
| 2004 | 62 | 89 |
| 2005 | 56 | 89 |
| 2006 | 49 | 98 |
| 2007 | 64 | 85 |
| 2008 | 55 | 124 |
| 2009 | 59 | 148 |
| 2010 | 110 | 122 |
| 2011 | 128 | 165 |
| 2012 | 125 | 190 |
| 2013 | 166 | 155 |
| 2014 | 212 | 175 |
| 2015 | 202 | 259 |
| 2016 | 239 | 240 |
| 2017 | 278 | 241 |
| 2018 | 247 | 257 |
| 2019 | 264 | 300 |
| 2020 | 313 | 477 |
| 2021 | 354 | 437 |
| 2022 | 328 | 487 |
| 2023 | 371 | 638 |
| 2024 | 412 | 508 |
| 2025 | 424 | 688 |
| 2026 | 219 | 545 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- 3D semiconductor device and method of forming the same6 Oct 2026US 12,757,391 B2Tokyo Electron Limited
- 3D-stacked semiconductor device having different channel and gate dimensions across lower stack and upper stack6 Oct 2026US 12,757,455 B2Samsung Electronics Co., Ltd.
- 3D-stacked semiconductor device including middle isolation structure and BSPDN structure6 Oct 2026US 12,757,485 B2Samsung Electronics Co., Ltd.
- Semiconductor storage device and manufacturing method thereof29 Sep 2026US 12,751,278 B2Kioxia Corporation
- 3D IC structure22 Sep 2026US 12,745,405 B2Etron Technology, Inc.
- Interconnect structure and method of forming same8 Oct 2026US 2026/0306859 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Reducing capacitive loading of memory system based on switches8 Oct 2026US 2026/0311734 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device and manufacturing method of the same8 Oct 2026US 2026/0313974 A1Semiconductor Energy Laboratory Co.Ltd.
- Stacked multi-gate device with diffusion stopping layer8 Oct 2026US 2026/0314063 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Package structure and method of forming the same8 Oct 2026US 2026/0314076 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Three dimensional structure memory1,560US 5,915,167 AElm Technology Corporation · 1999
- Three-dimensional memory array and method of fabrication829US 6,420,215 B1Matrix Semiconductor, Inc. · 2002
- Vertical-type non-volatile memory devices657US 7,679,133 B2Samsung Electronics Co., Ltd. · 2010
- Three-dimensional integrated circuit and manufacturing method thereof617US 4,939,568 AFujitsu Limited · 1990
- Process of fabricating three-dimensional semiconductor device576US 4,612,083 ANEC Corporation · 1986