H10D 88/01
Manufacture or treatment
Official title: {Manufacture or treatment}
H10D88/01 (Manufacture or treatment) appears on 2,492 US grants and 3,412 published applications in this corpus.
Search patents in H10D- Granted patents
- 2,492
- Published applications
- 3,412
- Assignees
- 345
- Inventors
- 3,511
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 4 | 0 |
| 1982 | 0 | 0 |
| 1983 | 2 | 0 |
| 1984 | 5 | 0 |
| 1985 | 7 | 0 |
| 1986 | 10 | 0 |
| 1987 | 13 | 0 |
| 1988 | 13 | 0 |
| 1989 | 9 | 0 |
| 1990 | 2 | 0 |
| 1991 | 18 | 0 |
| 1992 | 11 | 0 |
| 1993 | 11 | 0 |
| 1994 | 20 | 0 |
| 1995 | 12 | 0 |
| 1996 | 14 | 0 |
| 1997 | 15 | 0 |
| 1998 | 21 | 0 |
| 1999 | 17 | 0 |
| 2000 | 24 | 0 |
| 2001 | 20 | 8 |
| 2002 | 21 | 28 |
| 2003 | 29 | 53 |
| 2004 | 21 | 39 |
| 2005 | 23 | 35 |
| 2006 | 23 | 53 |
| 2007 | 34 | 46 |
| 2008 | 29 | 67 |
| 2009 | 25 | 64 |
| 2010 | 60 | 48 |
| 2011 | 64 | 56 |
| 2012 | 46 | 41 |
| 2013 | 53 | 33 |
| 2014 | 47 | 41 |
| 2015 | 46 | 62 |
| 2016 | 59 | 83 |
| 2017 | 94 | 97 |
| 2018 | 89 | 111 |
| 2019 | 130 | 158 |
| 2020 | 162 | 268 |
| 2021 | 190 | 232 |
| 2022 | 189 | 254 |
| 2023 | 200 | 392 |
| 2024 | 232 | 322 |
| 2025 | 242 | 469 |
| 2026 | 136 | 352 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- 3D semiconductor device and method of forming the same6 Oct 2026US 12,757,391 B2Tokyo Electron Limited
- 3D-stacked semiconductor device including middle isolation structure and BSPDN structure6 Oct 2026US 12,757,485 B2Samsung Electronics Co., Ltd.
- Semiconductor device15 Sep 2026US 12,740,138 B2Samsung Electronics Co., Ltd.
- Three-dimensional semiconductor device and method of fabricating the same15 Sep 2026US 12,740,139 B2Samsung Electronics Co., Ltd.
- Cross coupled stacked transistors8 Sep 2026US 12,733,256 B2International Business Machines Corporation
- Semiconductor device and manufacturing method of the same8 Oct 2026US 2026/0313974 A1Semiconductor Energy Laboratory Co.Ltd.
- Stacked multi-gate device with diffusion stopping layer8 Oct 2026US 2026/0314063 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Striker for wafer bonding8 Oct 2026US 2026/0314319 A1Tokyo Electron Limited
- 3D Stackable Memory and Methods of Manufacture1 Oct 2026US 2026/0304789 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Modular 3d lna integrated circuit24 Sep 2026US 2026/0293317 A1Murata Manufacturing Co., Ltd.
Most cited
By later US patents
- Three-dimensional memory array and method of fabrication829US 6,420,215 B1Matrix Semiconductor, Inc. · 2002
- Vertical-type non-volatile memory devices657US 7,679,133 B2Samsung Electronics Co., Ltd. · 2010
- Process of fabricating three-dimensional semiconductor device576US 4,612,083 ANEC Corporation · 1986
- Single crystal silicon arrayed devices for display panels540US 5,317,236 AKopin Corporation · 1994
- Three-dimensional integrated semiconductor devices526US 6,943,067 B2Advanced Micro Devices, Inc. · 2005