H10D 1/711
Having non-planar surfaces
Official title: {having non-planar surfaces, e.g. formed by texturisation}
H10D1/711 (Having non-planar surfaces) appears on 5,790 US grants and 6,000 published applications in this corpus.
Search patents in H10D- Granted patents
- 5,790
- Published applications
- 6,000
- Assignees
- 607
- Inventors
- 7,595
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 9 | 0 |
| 1992 | 25 | 0 |
| 1993 | 29 | 0 |
| 1994 | 26 | 0 |
| 1995 | 38 | 0 |
| 1996 | 48 | 0 |
| 1997 | 64 | 0 |
| 1998 | 106 | 0 |
| 1999 | 161 | 0 |
| 2000 | 281 | 0 |
| 2001 | 331 | 128 |
| 2002 | 280 | 282 |
| 2003 | 271 | 265 |
| 2004 | 255 | 259 |
| 2005 | 179 | 253 |
| 2006 | 206 | 301 |
| 2007 | 177 | 193 |
| 2008 | 149 | 166 |
| 2009 | 130 | 144 |
| 2010 | 174 | 188 |
| 2011 | 132 | 142 |
| 2012 | 115 | 182 |
| 2013 | 149 | 194 |
| 2014 | 193 | 165 |
| 2015 | 191 | 165 |
| 2016 | 150 | 137 |
| 2017 | 145 | 123 |
| 2018 | 127 | 153 |
| 2019 | 148 | 162 |
| 2020 | 176 | 244 |
| 2021 | 183 | 245 |
| 2022 | 194 | 318 |
| 2023 | 209 | 446 |
| 2024 | 253 | 364 |
| 2025 | 311 | 393 |
| 2026 | 173 | 388 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Capacitive element and semiconductor device6 Oct 2026US 12,757,714 B2Ablic Inc.
- Metal-insulator-metal structures and methods of forming the same29 Sep 2026US 12,751,283 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Logic device and manufacturing method thereof22 Sep 2026US 12,745,408 B2Samsung Electronics Co., Ltd.
- Semiconductor component with metal-insulator-metal capacitor assembly22 Sep 2026US 12,745,627 B2Imec Vzw
- High-density capacitive device having well-defined insulating areas15 Sep 2026US 12,738,427 B2Commissariat A L' Energie Atomique Et Aux Energies Alternatives
- Capacitor structure and semiconductor device including the same8 Oct 2026US 2026/0313876 A1Samsung Electronics Co., Ltd.
- Integrated chips package structure with capacitor8 Oct 2026US 2026/0313919 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Capacitor, method of manufacturing capacitor, and method of manufacturing memory device8 Oct 2026US 2026/0313923 A1EGTM Co., Ltd.
- Concentric dtc bumps for high density package decap solution8 Oct 2026US 2026/0313924 A1QUALCOMM Incorporated
- A Multi-Layer Deep-Trench Capacitor8 Oct 2026US 2026/0313925 A1Lotus Microsystems Aps
Most cited
By later US patents
- Dopant precursors and processes596US 6,743,738 B2ASM America, Inc. · 2004
- Method to reduce bit line capacitance in cub drams579US 6,472,266 B1Taiwan Semiconductor Manufacturing Company.Ltd · 2002
- Method of manufacturing charge storage device553US 7,405,166 B2Industrial Technology Research Institute · 2008
- Uniform dielectric film deposition on textured surfaces542US 5,801,104 AMicron Technology, Inc. · 1998
- Conformal thin films over textured capacitor electrodes542US 6,780,704 B1ASM International N.V. · 2004