H10D 1/714
Having horizontal extensions
Official title: {having horizontal extensions}
H10D1/714 (Having horizontal extensions) appears on 1,127 US grants and 1,241 published applications in this corpus.
Search patents in H10D- Granted patents
- 1,127
- Published applications
- 1,241
- Assignees
- 293
- Inventors
- 2,397
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 14 | 0 |
| 1993 | 6 | 0 |
| 1994 | 10 | 0 |
| 1995 | 10 | 0 |
| 1996 | 14 | 0 |
| 1997 | 19 | 0 |
| 1998 | 30 | 0 |
| 1999 | 33 | 0 |
| 2000 | 50 | 0 |
| 2001 | 44 | 17 |
| 2002 | 28 | 16 |
| 2003 | 25 | 10 |
| 2004 | 12 | 13 |
| 2005 | 11 | 10 |
| 2006 | 11 | 13 |
| 2007 | 11 | 17 |
| 2008 | 8 | 11 |
| 2009 | 6 | 15 |
| 2010 | 14 | 34 |
| 2011 | 16 | 23 |
| 2012 | 25 | 39 |
| 2013 | 32 | 42 |
| 2014 | 37 | 49 |
| 2015 | 55 | 45 |
| 2016 | 50 | 45 |
| 2017 | 48 | 45 |
| 2018 | 47 | 57 |
| 2019 | 57 | 67 |
| 2020 | 68 | 73 |
| 2021 | 46 | 62 |
| 2022 | 54 | 84 |
| 2023 | 60 | 85 |
| 2024 | 60 | 101 |
| 2025 | 67 | 99 |
| 2026 | 43 | 169 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Capacitive element and semiconductor device6 Oct 2026US 12,757,714 B2Ablic Inc.
- Semiconductor component with metal-insulator-metal capacitor assembly22 Sep 2026US 12,745,627 B2Imec Vzw
- Semiconductor device and method for fabricating the same8 Sep 2026US 12,733,153 B2SK hynix Inc.
- Integrated circuit and method of manufacturing the same18 Aug 2026US 12,713,684 B2Samsung Electronics Co., Ltd.
- Multilayer capacitors with interdigitated fingers18 Aug 2026US 12,713,906 B2Skyworks Solutions, Inc.
- Capacitor structure and semiconductor device including the same8 Oct 2026US 2026/0313876 A1Samsung Electronics Co., Ltd.
- Capacitor, method of manufacturing capacitor, and method of manufacturing memory device8 Oct 2026US 2026/0313923 A1EGTM Co., Ltd.
- A Multi-Layer Deep-Trench Capacitor8 Oct 2026US 2026/0313925 A1Lotus Microsystems Aps
- Package structure and method for forming the same8 Oct 2026US 2026/0314394 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Semiconductor device, memory and manufacturing method therefor, and electronic device1 Oct 2026US 2026/0304755 A1
Most cited
By later US patents
- Capacitor structure for an integrated circuit396US 5,583,359 ANorthern Telecom Limited · 1996
- Integrated capacitor bottom electrode for use with conformal dielectric382US 5,754,390 AMicron Technology, Inc. · 1998
- Method of forming a bit line over capacitor array of memory cells246US 5,338,700 AMicron Semiconductor, Inc. · 1994
- Method of fabricating a self-aligned crown-shaped capacitor for high density DRAM cells224US 6,063,683 AAcer Semiconductor Manufacturing Inc. · 2000
- Method of forming a bit line over capacitor array of memory cells192US 5,401,681 AMicron Technology, Inc. · 1995