Multilayer capacitors with interdigitated fingers
AssigneeSkyworks Solutions, Inc.
InventorsHailing Wang, Guillaume Alexandre Blin, David Scott Whitefield, Michael Joseph McPartlin, Lui Ray Lam
Life of this patent
Estimating the term…
Loading patent…
AssigneeSkyworks Solutions, Inc.
InventorsHailing Wang, Guillaume Alexandre Blin, David Scott Whitefield, Michael Joseph McPartlin, Lui Ray Lam
Estimating the term…
A circuit can include a capacitor that has a semiconductor layer, a dielectric layer, and a conductive layer. The circuit can include an insulating layer and a metal or conductive layer. The metal layer can have a first portion that has a first plurality of fingers, and a second portion that has a second plurality of fingers, which can be interdigitated with the first plurality of fingers. The circuit can include one or more first electrical connections that electrically couple the first portion of the metal layer to the semiconductor layer of the capacitor. The circuit can include one or more second electrical connections that electrically couple the second portion of the metal layer to the conductive layer of the capacitor. A capacitance provided by the interdigitated first and second pluralities of fingers can be at least about 3% of a capacitance provided by the capacitor.
A circuit comprising:
A method of making a circuit, the method comprising:
A capacitor comprising:
Dependencies are inferred from the claim text.