H05K 3/184
Using masks
Official title: {using masks}
H05K3/184 (Using masks) appears on 353 US grants and 258 published applications in this corpus.
Search patents in H05K- Granted patents
- 353
- Published applications
- 258
- Assignees
- 190
- Inventors
- 885
- Latest grant
- 14 Apr 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 5 | 0 |
| 1977 | 2 | 0 |
| 1978 | 5 | 0 |
| 1979 | 2 | 0 |
| 1980 | 0 | 0 |
| 1981 | 6 | 0 |
| 1982 | 1 | 0 |
| 1983 | 4 | 0 |
| 1984 | 5 | 0 |
| 1985 | 4 | 0 |
| 1986 | 8 | 0 |
| 1987 | 5 | 0 |
| 1988 | 15 | 0 |
| 1989 | 15 | 0 |
| 1990 | 17 | 0 |
| 1991 | 11 | 0 |
| 1992 | 11 | 0 |
| 1993 | 6 | 0 |
| 1994 | 5 | 0 |
| 1995 | 7 | 0 |
| 1996 | 10 | 0 |
| 1997 | 6 | 0 |
| 1998 | 8 | 0 |
| 1999 | 10 | 0 |
| 2000 | 7 | 0 |
| 2001 | 14 | 6 |
| 2002 | 7 | 11 |
| 2003 | 9 | 12 |
| 2004 | 13 | 15 |
| 2005 | 6 | 10 |
| 2006 | 5 | 12 |
| 2007 | 7 | 12 |
| 2008 | 4 | 11 |
| 2009 | 5 | 16 |
| 2010 | 3 | 11 |
| 2011 | 6 | 12 |
| 2012 | 15 | 9 |
| 2013 | 5 | 10 |
| 2014 | 8 | 6 |
| 2015 | 9 | 12 |
| 2016 | 5 | 6 |
| 2017 | 6 | 12 |
| 2018 | 7 | 13 |
| 2019 | 9 | 10 |
| 2020 | 9 | 10 |
| 2021 | 4 | 8 |
| 2022 | 5 | 10 |
| 2023 | 4 | 7 |
| 2024 | 4 | 3 |
| 2025 | 8 | 6 |
| 2026 | 1 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Copper clad laminate and method for producing the same14 Apr 2026US 12,604,417 B2Toyo Kohan Co.Ltd
- Semi-additive process for catalytic printed circuit boards30 Dec 2025US 12,513,827 B2Catlam, LLC
- Method of preparing a high density interconnect printed circuit board including microvias filled with copper7 Oct 2025US 12,439,528 B2Atotech Deutschland GmbH
- Photosensitive composition and photoresist dry film made therefrom30 Sep 2025US 12,429,769 B2Dupont Electronics, Inc.
- Deposition apparatus, method of deposition on a substrate, substrate structure and substrate support26 Aug 2025US 12,400,891 B2Applied Materials Italia S.R.L.
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing wiring substrate1 Oct 2026US 2026/0299416 A1Resonac Corporation
- Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board1 Oct 2026US 2026/0304638 A1Resonac Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board17 Sep 2026US 2026/0282237 A1Resonac Corporation
- Conductive film and display device27 Aug 2026US 2026/0254101 A1TDK Corporation
- Liquid crystal polymer dielectric powder or 3d printed material27 Aug 2026US 2026/0255492 A1LCP Medical Technologies, Inc.
Most cited
By later US patents
- Selective plating method for forming integral via and wiring layers210US 5,209,817 AInternational Business Machines Corporation · 1993
- Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same197US 5,175,060 AIbiden Co., Ltd. · 1992
- Structure having laser ablated features and method of fabricating179US 6,730,857 B2International Business Machines Corporation · 2004
- Structure having laser ablated features and method of fabricating154US 6,919,514 B2International Business Machines Corporation · 2005
- Printed circuit board having an injection molded substrate127US 4,996,391 ASiemens Aktiengesellschaft · 1991