H05K 3/181
By electroless plating
Official title: {by electroless plating (adhesives therefor H05K3/387)}
H05K3/181 (By electroless plating) appears on 1,596 US grants and 1,274 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,596
- Published applications
- 1,274
- Assignees
- 649
- Inventors
- 3,477
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 27 | 0 |
| 1977 | 17 | 0 |
| 1978 | 16 | 0 |
| 1979 | 14 | 0 |
| 1980 | 17 | 0 |
| 1981 | 39 | 0 |
| 1982 | 32 | 0 |
| 1983 | 18 | 0 |
| 1984 | 24 | 0 |
| 1985 | 34 | 0 |
| 1986 | 31 | 0 |
| 1987 | 44 | 0 |
| 1988 | 42 | 0 |
| 1989 | 51 | 0 |
| 1990 | 52 | 0 |
| 1991 | 37 | 0 |
| 1992 | 36 | 0 |
| 1993 | 36 | 0 |
| 1994 | 30 | 0 |
| 1995 | 33 | 0 |
| 1996 | 31 | 0 |
| 1997 | 18 | 0 |
| 1998 | 24 | 0 |
| 1999 | 38 | 0 |
| 2000 | 33 | 0 |
| 2001 | 36 | 15 |
| 2002 | 23 | 35 |
| 2003 | 26 | 36 |
| 2004 | 40 | 63 |
| 2005 | 22 | 64 |
| 2006 | 25 | 46 |
| 2007 | 25 | 60 |
| 2008 | 18 | 50 |
| 2009 | 23 | 89 |
| 2010 | 24 | 61 |
| 2011 | 27 | 54 |
| 2012 | 51 | 41 |
| 2013 | 23 | 38 |
| 2014 | 39 | 56 |
| 2015 | 29 | 77 |
| 2016 | 45 | 84 |
| 2017 | 54 | 69 |
| 2018 | 56 | 50 |
| 2019 | 41 | 57 |
| 2020 | 48 | 49 |
| 2021 | 36 | 36 |
| 2022 | 26 | 42 |
| 2023 | 25 | 31 |
| 2024 | 25 | 31 |
| 2025 | 20 | 24 |
| 2026 | 15 | 16 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards25 Aug 2026US 12,716,133 B2Atotech Deutschland GmbH
- Wiring substrate28 Jul 2026US 12,696,392 B2Ibiden Co., Ltd.
- Flexible printed circuit board and method of manufacturing flexible printed circuit board30 Jun 2026US 12,672,243 B2Sumitomo Electric Industries, Ltd.
- Wiring substrate and method for manufacturing the same23 Jun 2026US 12,666,540 B2Ibiden Co., Ltd.
- Power component submount and manufacturing method thereof23 Jun 2026US 12,666,542 B2Tong Hsing Electronic Industries, Ltd.
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing wiring substrate1 Oct 2026US 2026/0299416 A1Resonac Corporation
- Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board1 Oct 2026US 2026/0304638 A1Resonac Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board17 Sep 2026US 2026/0282237 A1Resonac Corporation
- Conductive film and display device27 Aug 2026US 2026/0254101 A1TDK Corporation
- Fabricating electronic devices with metallized internal structures using 3d printing and microfluidic electroless plating27 Aug 2026US 2026/0255484 A1Atomic Semi Inc.
Most cited
By later US patents
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Electroless metal deposition of electronic components in an enclosable vessel270US 6,165,912 ACFMT, Inc. · 2000
- Two-step preplate system for polymeric surfaces257US 4,234,628 AThe Harshaw Chemical Company · 1980
- Aluminum-palladium alloy for initiation of electroless plating257US 5,907,790 AAstarix Inc. · 1999
- Process for forming polyimide-metal laminates253US 5,478,462 APolyonics Corporation · 1995