Two-step preplate system for polymeric surfaces
AssigneeThe Harshaw Chemical Company
InventorArthur H. DuRose
Life of this patent
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Abstract
Non-metallic surfaces are prepared to receive an electroless metal deposit of copper, gold or nickel using a two-step adsorption procedure to sensitize the surface. The surface is first immersed in a bath containing copper in solution or suspension to adsorb the copper on the surface, followed by contact with a nickel or cobalt bath at a pH above 4 to encourage adsorption of the second metal. The adsorbed metals are then reduced with a borohydride reducing agent, with the nickel or cobalt serving to catalyze the reduction of the copper. The surface can be rinsed between the two adsorption steps without decreasing the effectiveness of the treatment.
Claims8
A process of preparing a non-metallic surface for the electroless deposition of a metallic layer of copper, nickel or gold comprising the steps of
- (a) contacting the surface with a copper compound available from a bath selected from the group consisting of
- (1) a solution of a simple cupric compound;
- (2) a basic cupric hydrate suspension or colloid prepared by adding an alkali to the solution of (1);
- (3) a clear cuprate solution;
- and
- (4) a complex solution of copper containing a suitable complexing agent;
- (b) thereafter contacting the surface with an accelerator selected from the group consisting of
- (1) a nickel salt;
- and
- (2) a cobalt salt
- available as a simple solution, suspension or a complex solution;
- (c) rinsing the surface;
- and
- (d) contacting the surface with a reducing agent selected from the group consisting of a borohydride, hydrazine and a borane.
A preplating process for preparation of a polymeric article including the sequential steps of
- (a) immersing the article in a copper bath for a time interval ranging from 15 seconds to 10 minutes, said copper bath selected from the group consisting of
- (1) a clear aqueous solution containing a cupric compound wherein the copper is present in a concentration range of 0.0005 m/l to saturation;
- (2) a basic hydrate sol or suspension formed by adding an alkali to the clear solution of (1) until the final pH is between about 3.9 and about 10 wherein the concentration range of the copper in the sol is 0.0005 L to 0.6 m/l;
- (3) a clear cuprate solution formed by adding a high concentration of an alkali to the solution of (1);
- (4) a complex solution of copper formed by the addition of a complexing agent to the clear solution of (1) wherein the concentration range of the copper is 0.0005 to 2 m/l;
- (5) a momovalent complex of a copper halide or of a copper cyanide containing no excess cyanide;
- and
- (6) a clear or complexed cupric solution containing an organic solvent;
- (b) immersing the article in a nickel or cobalt bath maintained at a pH of 4 or above for a period of time between 15 seconds and 10 minutes, said bath selected from the group consisting of
- (1) a simple solution in which the concentration of the nickel or cobalt is between 0.0005 m/l and saturation;
- (2) a suspension formed by adding an alkali to the solution of (b) (1) in which the nickel or cobalt concentration is 0.0005 to 0.6 m/l;
- (3) a stable suspension formed by the addition of 1-100 g/l of a polyhydric alcohol to the suspension of (b) (2);
- and
- (4) a complex solution formed by the addition of a complexing agent to the simple solution of (b) (1) at an effective pH above 6.0;
- (c) rinsing the article with water to remove excess bath material;
- and
- (d) immersing the article in a bath containing a reducing agent selected from the group consisting of a borohydride, hydrazine and a borane.
Dependencies are inferred from the claim text.