Power component submount and manufacturing method thereof

A power component submount, comprising:

• a ceramic substrate having two board surfaces respectively arranged on two opposite sides thereof;
• a sputtering layer including a plurality of electroplating portions respectively formed on the two board surfaces of the ceramic substrate;
• a plurality of conductive blocks respectively formed on the electroplating portions;
• two insulting layers respectively formed on the two board surfaces of the ceramic substrate, wherein the conductive blocks are embedded in the two insulating layers, and wherein the two insulating layers have a plurality of electroless plating slots, and each of the electroless plating slots is formed to enable one of the conductive blocks to be exposed therefrom;
• a plurality of first electroless plating conductors respectively formed in the electroless plating slots, and each of the first electroless plating conductors includes:
• a first electroless plating layer connected to a corresponding one of the conductive blocks and being made of gold (Au) or nickel (Ni);
• a second electroless plating layer connected to the first electroless plating layer and being made of palladium (Pd);
• and
• a third electroless plating layer connected to the second electroless plating layer and being made of gold (Au);
• and
• a plurality of second electroless plating conductors respectively formed on the outer surfaces of the two insulating layers, wherein each of the second electroless plating conductors is connected to at least two of the first electroless plating conductors.