H05K 3/182
Characterised by the patterning method
Official title: {characterised by the patterning method}
H05K3/182 (Characterised by the patterning method) appears on 883 US grants and 825 published applications in this corpus.
Search patents in H05K- Granted patents
- 883
- Published applications
- 825
- Assignees
- 435
- Inventors
- 2,108
- Latest grant
- 12 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 13 | 0 |
| 1977 | 4 | 0 |
| 1978 | 8 | 0 |
| 1979 | 5 | 0 |
| 1980 | 6 | 0 |
| 1981 | 17 | 0 |
| 1982 | 4 | 0 |
| 1983 | 5 | 0 |
| 1984 | 10 | 0 |
| 1985 | 11 | 0 |
| 1986 | 14 | 0 |
| 1987 | 16 | 0 |
| 1988 | 19 | 0 |
| 1989 | 21 | 0 |
| 1990 | 25 | 0 |
| 1991 | 19 | 0 |
| 1992 | 24 | 0 |
| 1993 | 15 | 0 |
| 1994 | 9 | 0 |
| 1995 | 16 | 0 |
| 1996 | 17 | 0 |
| 1997 | 9 | 0 |
| 1998 | 15 | 0 |
| 1999 | 23 | 0 |
| 2000 | 19 | 0 |
| 2001 | 24 | 9 |
| 2002 | 15 | 25 |
| 2003 | 18 | 23 |
| 2004 | 28 | 41 |
| 2005 | 16 | 44 |
| 2006 | 15 | 33 |
| 2007 | 16 | 40 |
| 2008 | 15 | 32 |
| 2009 | 19 | 53 |
| 2010 | 17 | 40 |
| 2011 | 18 | 32 |
| 2012 | 36 | 31 |
| 2013 | 14 | 31 |
| 2014 | 27 | 48 |
| 2015 | 21 | 58 |
| 2016 | 32 | 56 |
| 2017 | 37 | 42 |
| 2018 | 37 | 32 |
| 2019 | 31 | 39 |
| 2020 | 28 | 32 |
| 2021 | 26 | 22 |
| 2022 | 13 | 17 |
| 2023 | 10 | 15 |
| 2024 | 12 | 11 |
| 2025 | 10 | 8 |
| 2026 | 4 | 11 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Wiring substrate12 May 2026US 12,628,283 B2Ibiden Co., Ltd.
- Copper clad laminate and method for producing the same14 Apr 2026US 12,604,417 B2Toyo Kohan Co.Ltd
- Catalyst ink for plating and electroless plating method using same10 Feb 2026US 12,545,799 B2Korea Electrotechnology Research Institute
- Electronic device including outer housing plated with conductive member and manufacturing method therefor3 Feb 2026US 12,540,402 B2Intops Co., Ltd.
- Semi-additive process for catalytic printed circuit boards30 Dec 2025US 12,513,827 B2Catlam, LLC
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing wiring substrate1 Oct 2026US 2026/0299416 A1Resonac Corporation
- Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board1 Oct 2026US 2026/0304638 A1Resonac Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board17 Sep 2026US 2026/0282237 A1Resonac Corporation
- Conductive film and display device27 Aug 2026US 2026/0254101 A1TDK Corporation
- Fabricating electronic devices with metallized internal structures using 3d printing and microfluidic electroless plating27 Aug 2026US 2026/0255484 A1Atomic Semi Inc.
Most cited
By later US patents
- High resolution patterning on solid substrates236US 5,079,600 A1992
- Electronic part and a method of manufacturing the same236US 6,292,139 B1Murata Manufacturing Co., Ltd. · 2001
- Selective plating method for forming integral via and wiring layers210US 5,209,817 AInternational Business Machines Corporation · 1993
- Leadframe semiconductor-mounting substrate having a roughened adhesive conductor circuit substrate and method of producing the same197US 5,175,060 AIbiden Co., Ltd. · 1992
- Structure having laser ablated features and method of fabricating179US 6,730,857 B2International Business Machines Corporation · 2004