H05K 3/18
Using precipitation techniques to apply the conductive material
Official title: using precipitation techniques to apply the conductive material
H05K3/18 (Using precipitation techniques to apply the conductive material) appears on 1,979 US grants and 1,753 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,979
- Published applications
- 1,753
- Assignees
- 786
- Inventors
- 4,296
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 28 | 0 |
| 1977 | 19 | 0 |
| 1978 | 16 | 0 |
| 1979 | 14 | 0 |
| 1980 | 17 | 0 |
| 1981 | 39 | 0 |
| 1982 | 32 | 0 |
| 1983 | 19 | 0 |
| 1984 | 24 | 0 |
| 1985 | 36 | 0 |
| 1986 | 39 | 0 |
| 1987 | 51 | 0 |
| 1988 | 45 | 0 |
| 1989 | 56 | 0 |
| 1990 | 56 | 0 |
| 1991 | 41 | 0 |
| 1992 | 37 | 0 |
| 1993 | 40 | 0 |
| 1994 | 33 | 0 |
| 1995 | 38 | 0 |
| 1996 | 32 | 0 |
| 1997 | 22 | 0 |
| 1998 | 26 | 0 |
| 1999 | 39 | 0 |
| 2000 | 34 | 0 |
| 2001 | 38 | 15 |
| 2002 | 25 | 39 |
| 2003 | 31 | 40 |
| 2004 | 42 | 66 |
| 2005 | 23 | 69 |
| 2006 | 27 | 50 |
| 2007 | 27 | 66 |
| 2008 | 21 | 54 |
| 2009 | 23 | 90 |
| 2010 | 27 | 76 |
| 2011 | 32 | 59 |
| 2012 | 54 | 48 |
| 2013 | 25 | 48 |
| 2014 | 43 | 66 |
| 2015 | 36 | 99 |
| 2016 | 65 | 125 |
| 2017 | 78 | 101 |
| 2018 | 88 | 87 |
| 2019 | 78 | 95 |
| 2020 | 72 | 74 |
| 2021 | 59 | 51 |
| 2022 | 49 | 82 |
| 2023 | 50 | 65 |
| 2024 | 52 | 88 |
| 2025 | 44 | 57 |
| 2026 | 37 | 43 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Electrical interconnect structure with circuit bearing dielectric layers and resultant dielectric spacing control and circuit pitch reduction8 Sep 2026US 12,733,109 B2
- Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards25 Aug 2026US 12,716,133 B2Atotech Deutschland GmbH
- Wiring board and manufacturing method for the same18 Aug 2026US 12,713,526 B2KYOCERA Corporation
- Circuit board11 Aug 2026US 12,707,563 B2LG Innotek Co., Ltd.
- Wiring substrate28 Jul 2026US 12,696,392 B2Ibiden Co., Ltd.
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board1 Oct 2026US 2026/0299414 A1Resonac Corporation
- Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for manufacturing wiring substrate1 Oct 2026US 2026/0299416 A1Resonac Corporation
- Wiring board and method for producing same1 Oct 2026US 2026/0304607 A1KYOCERA Corporation
- Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board1 Oct 2026US 2026/0304638 A1Resonac Corporation
- Multi-layer circuit board and processing method therefor, chip system, and electronic device24 Sep 2026US 2026/0293001 A1Huawei Technologies Co., Ltd.
Most cited
By later US patents
- Seed layer deposition558US 6,824,665 B2Shipley Company, L.L.C. · 2004
- Electroless metal deposition of electronic components in an enclosable vessel270US 6,165,912 ACFMT, Inc. · 2000
- Two-step preplate system for polymeric surfaces257US 4,234,628 AThe Harshaw Chemical Company · 1980
- Aluminum-palladium alloy for initiation of electroless plating257US 5,907,790 AAstarix Inc. · 1999
- Process for forming polyimide-metal laminates253US 5,478,462 APolyonics Corporation · 1995