H05K 3/188
By direct electroplating
Official title: {by direct electroplating}
H05K3/188 (By direct electroplating) appears on 344 US grants and 392 published applications in this corpus.
Search patents in H05K- Granted patents
- 344
- Published applications
- 392
- Assignees
- 202
- Inventors
- 876
- Latest grant
- 11 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 2 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 8 | 0 |
| 1987 | 9 | 0 |
| 1988 | 4 | 0 |
| 1989 | 5 | 0 |
| 1990 | 4 | 0 |
| 1991 | 6 | 0 |
| 1992 | 1 | 0 |
| 1993 | 4 | 0 |
| 1994 | 3 | 0 |
| 1995 | 5 | 0 |
| 1996 | 1 | 0 |
| 1997 | 5 | 0 |
| 1998 | 2 | 0 |
| 1999 | 5 | 0 |
| 2000 | 1 | 0 |
| 2001 | 3 | 0 |
| 2002 | 2 | 4 |
| 2003 | 4 | 4 |
| 2004 | 2 | 4 |
| 2005 | 1 | 7 |
| 2006 | 3 | 5 |
| 2007 | 2 | 6 |
| 2008 | 4 | 4 |
| 2009 | 0 | 2 |
| 2010 | 3 | 14 |
| 2011 | 5 | 6 |
| 2012 | 2 | 4 |
| 2013 | 2 | 4 |
| 2014 | 3 | 9 |
| 2015 | 6 | 28 |
| 2016 | 20 | 39 |
| 2017 | 28 | 33 |
| 2018 | 26 | 34 |
| 2019 | 33 | 30 |
| 2020 | 27 | 27 |
| 2021 | 20 | 17 |
| 2022 | 15 | 28 |
| 2023 | 18 | 22 |
| 2024 | 24 | 29 |
| 2025 | 16 | 18 |
| 2026 | 8 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Circuit board11 Aug 2026US 12,707,563 B2LG Innotek Co., Ltd.
- Power component submount and manufacturing method thereof23 Jun 2026US 12,666,542 B2Tong Hsing Electronic Industries, Ltd.
- Method of manufacturing printed circuit board2 Jun 2026US 12,648,086 B2Samsung Electro-Mechanics Co., Ltd.
- Patterned article including metallic bodies10 Mar 2026US 12,573,766 B23M Innovative Properties Company
- Inductor assembly and manufacturing method for inductor assembly3 Mar 2026US 12,568,586 B2Shennan Circuits Co., Ltd.
- Wiring board and method for producing same1 Oct 2026US 2026/0304607 A1KYOCERA Corporation
- Multi-layer circuit board and processing method therefor, chip system, and electronic device24 Sep 2026US 2026/0293001 A1Huawei Technologies Co., Ltd.
- Carbon-based direct plating process13 Aug 2026US 2026/0234828 A1
- Package substrate and fabricating method thereof13 Aug 2026US 2026/0239533 A1AaltoSemi Inc.
- Aluminum matrix composite material and preparation method therefor, and electronic device2 Jul 2026US 2026/0185258 A1Huawei Technologies Co., Ltd.
Most cited
By later US patents
- Additive adhesive based process for the manufacture of printed circuit boards127US 4,581,301 A1986
- Conductive coatings109US 5,766,515 ABayer Aktiengessellschaft · 1998
- Apparatus for laser machining with a plurality of beams80US 5,676,866 AHewlett-Packard Company · 1997
- Biocompatible bonding method and electronics package suitable for implantation74US 7,142,909 B2Second Sight Medical Products, Inc. · 2006
- Fabrication of printed circuit boards using conducting polymer64US 5,300,208 AInternational Business Machines Corporation · 1994