H05K 3/187
Means therefor
Official title: {means therefor, e.g. baths, apparatus}
H05K3/187 (Means therefor) appears on 79 US grants and 67 published applications in this corpus.
Search patents in H05K- Granted patents
- 79
- Published applications
- 67
- Assignees
- 51
- Inventors
- 263
- Latest grant
- 25 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 5 | 0 |
| 1988 | 4 | 0 |
| 1989 | 3 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 2 | 0 |
| 1994 | 2 | 0 |
| 1995 | 2 | 0 |
| 1996 | 2 | 0 |
| 1997 | 1 | 0 |
| 1998 | 0 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 0 | 1 |
| 2002 | 1 | 2 |
| 2003 | 1 | 1 |
| 2004 | 3 | 2 |
| 2005 | 1 | 1 |
| 2006 | 1 | 1 |
| 2007 | 1 | 1 |
| 2008 | 0 | 1 |
| 2009 | 1 | 2 |
| 2010 | 0 | 1 |
| 2011 | 1 | 1 |
| 2012 | 0 | 2 |
| 2013 | 0 | 0 |
| 2014 | 0 | 5 |
| 2015 | 1 | 5 |
| 2016 | 5 | 10 |
| 2017 | 7 | 8 |
| 2018 | 3 | 4 |
| 2019 | 1 | 5 |
| 2020 | 3 | 0 |
| 2021 | 2 | 1 |
| 2022 | 0 | 4 |
| 2023 | 0 | 1 |
| 2024 | 2 | 3 |
| 2025 | 3 | 4 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards25 Aug 2026US 12,716,133 B2Atotech Deutschland GmbH
- Aqueous alkaline cleaner solution for glass filler removal and method17 Mar 2026US 12,577,500 B2Atotech Deutschland GmbH
- Method of preparing a high density interconnect printed circuit board including microvias filled with copper7 Oct 2025US 12,439,528 B2Atotech Deutschland GmbH
- Method for selective metallisation of inorganic dielectrics or semiconductors17 Jun 2025US 12,336,114 B2Valstybinis Moksliniu Tyrimu Institutas Fiziniu Ir Technologijos Mokslu Centras
- Method of preparing a high density interconnect printed circuit board including microvias filled with copper4 Mar 2025US 12,245,383 B2Atotech Deutschland GmbH
- Fabricating electronic devices with metallized internal structures using 3d printing and microfluidic electroless plating27 Aug 2026US 2026/0255484 A1Atomic Semi Inc.
- Process for wet-chemical formation of a stable tin oxide layer for printed circuit boards6 Nov 2025US 2025/0340994 A1Atotech Deutschland GmbH
- Method of making transparent composite articles30 Jan 2025US 2025/0033327 A1Eastman Kodak Company
- Transparent composite article with electrically-conductive pattern30 Jan 2025US 2025/0034345 A1Eastman Kodak Company
- Article with electrically-conductive pattern30 Jan 2025US 2025/0037900 A1Eastman Kodak Company
Most cited
By later US patents
- Electroless metal deposition of electronic components in an enclosable vessel270US 6,165,912 ACFMT, Inc. · 2000
- Electroless copper plating process with dissolved oxygen maintained in bath36US 4,152,467 AInternational Business Machines Corporation · 1979
- Process for producing printed circuit boards31US 4,512,829 ASatosen Co., Ltd. · 1985
- Method of consistently producing a copper deposit on a substrate by electroless deposition which deposit is essentially free of fissures29US 4,908,242 AKollmorgen Corporation · 1990
- Process for forming copper coating having excellent mechanical properties, and printed-wiring board with conductor pattern formed of such copper coating28US 4,777,078 ABrother Kogyo Kabushiki Kaisha · 1988