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US 4,152,467 AGranted
Electroless copper plating process with dissolved oxygen maintained in bath
AssigneeInternational Business Machines Corporation
InventorsWarren A. Alpaugh, Theodore D. Zucconi
Life of this patent
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Abstract
Copper is electrolessly deposited on a surface wherein the dissolved oxygen content is maintained between 2 and 4 ppm in the plating bath.
Claims21
A process for electrolessly depositing copper on a surface which is catalytic for the deposition of copper which comprises contacting the surface to be plated with a copper plating bath and maintaining during the plating a level of dissolved O.sub.2 in the bath between 2 and 4 ppm.
Dependencies are inferred from the claim text.