H05K 2201/096
Vertically aligned vias, holes or stacked vias
H05K2201/096 (Vertically aligned vias, holes or stacked vias) appears on 1,224 US grants and 1,330 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,224
- Published applications
- 1,330
- Assignees
- 307
- Inventors
- 2,328
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 3 | 0 |
| 1978 | 2 | 0 |
| 1979 | 0 | 0 |
| 1980 | 2 | 0 |
| 1981 | 3 | 0 |
| 1982 | 2 | 0 |
| 1983 | 4 | 0 |
| 1984 | 2 | 0 |
| 1985 | 7 | 0 |
| 1986 | 5 | 0 |
| 1987 | 9 | 0 |
| 1988 | 8 | 0 |
| 1989 | 8 | 0 |
| 1990 | 12 | 0 |
| 1991 | 7 | 0 |
| 1992 | 17 | 0 |
| 1993 | 10 | 0 |
| 1994 | 12 | 0 |
| 1995 | 16 | 0 |
| 1996 | 15 | 0 |
| 1997 | 8 | 0 |
| 1998 | 21 | 0 |
| 1999 | 19 | 0 |
| 2000 | 15 | 0 |
| 2001 | 26 | 18 |
| 2002 | 29 | 30 |
| 2003 | 32 | 39 |
| 2004 | 30 | 49 |
| 2005 | 31 | 54 |
| 2006 | 30 | 52 |
| 2007 | 26 | 67 |
| 2008 | 47 | 102 |
| 2009 | 34 | 88 |
| 2010 | 56 | 74 |
| 2011 | 69 | 65 |
| 2012 | 62 | 49 |
| 2013 | 64 | 27 |
| 2014 | 41 | 36 |
| 2015 | 33 | 49 |
| 2016 | 34 | 41 |
| 2017 | 51 | 31 |
| 2018 | 31 | 33 |
| 2019 | 34 | 39 |
| 2020 | 38 | 50 |
| 2021 | 31 | 35 |
| 2022 | 33 | 56 |
| 2023 | 35 | 59 |
| 2024 | 44 | 67 |
| 2025 | 47 | 72 |
| 2026 | 29 | 48 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Buried skip vias for improved signal and power integrity6 Oct 2026US 12,757,327 B2NVIDIA Corporation
- Electronic device comprising interposer printed circuit board22 Sep 2026US 12,745,349 B2Samsung Electronics Co., Ltd.
- Package comprising a substrate with an interconnect block8 Sep 2026US 12,733,095 B2QUALCOMM Incorporated
- Circuit board11 Aug 2026US 12,707,559 B2LG Innotek Co., Ltd.
- Wiring substrate4 Aug 2026US 12,701,658 B2Ibiden Co., Ltd.
- Printed circuit board and manufacturing method thereof1 Oct 2026US 2026/0304620 A1LG Electronics Inc.
- Wiring substrate1 Oct 2026US 2026/0304622 A1Shinko Electric Industries Co., Ltd.
- Circuit structure and manufacturing method thereof1 Oct 2026US 2026/0304623 A1Siliconware Precision Industries Co., Ltd.
- Printed circuit board24 Sep 2026US 2026/0292985 A1Samsung Electro-Mechanics Co., Ltd.
- Wiring substrate24 Sep 2026US 2026/0292986 A1Ibiden Co., Ltd.
Most cited
By later US patents
- Integrated structures and fabrication methods thereof implementing a cell phone or other electronic system387US 7,619,901 B2EPIC Technologies, Inc. · 2009
- High-density, multi-level interconnects, flex circuits, and tape for tab285US 5,106,461 AMassachusetts Institute of Technology · 1992
- High density circuit board and method of making same275US 5,191,174 AInternational Business Machines Corporation · 1993
- Parallel process interposer (PPI)263US 5,404,044 AInternational Business Machines Corporation · 1995
- Interconnection method and structure for organic circuit boards248US 5,435,057 AInternational Business Machines Corporation · 1995