Wiring substrate
AssigneeIbiden Co., Ltd.
InventorNaoki AWANO
Life of this patent
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Abstract
A wiring substrate includes a first conductive layer, an insulating layer covering the first conductive layer, a second conductive layer formed on the insulating layer, and a via conductor formed in the insulating layer such that the via conductor is penetrating through the insulating layer and connecting the first conductive layer and the second conductive layer. The first conductive layer is formed such that the first conductive layer includes a pad connected to the via conductor and a solid pattern having an opening surrounding the pad and that gaps are formed between a side surface of the pad and the insulating layer and/or between an inner side surface of the opening of the solid pattern and the insulating layer.
Claims20
A wiring substrate, comprising:
- a first conductive layer;
- an insulating layer covering the first conductive layer;
- a second conductive layer formed on the insulating layer;
- and
- a via conductor formed in the insulating layer such that the via conductor is penetrating through the insulating layer and connecting the first conductive layer and the second conductive layer,
- wherein the first conductive layer is formed such that the first conductive layer includes a pad connected to the via conductor and a solid pattern having an opening surrounding the pad and that a plurality of gaps is formed between a side surface of the pad and the insulating layer and/or between an inner side surface of the opening of the solid pattern and the insulating layer.
Dependencies are inferred from the claim text.