H05K 1/0237
High frequency adaptations
Official title: {High frequency adaptations (H05K1/0216 takes precedence)}
H05K1/0237 (High frequency adaptations) appears on 5,718 US grants and 6,171 published applications in this corpus.
Search patents in H05K- Granted patents
- 5,718
- Published applications
- 6,171
- Assignees
- 1,613
- Inventors
- 10,836
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 8 | 0 |
| 1977 | 4 | 0 |
| 1978 | 2 | 0 |
| 1979 | 3 | 0 |
| 1980 | 5 | 0 |
| 1981 | 3 | 0 |
| 1982 | 3 | 0 |
| 1983 | 4 | 0 |
| 1984 | 8 | 0 |
| 1985 | 12 | 0 |
| 1986 | 13 | 0 |
| 1987 | 22 | 0 |
| 1988 | 23 | 0 |
| 1989 | 27 | 0 |
| 1990 | 18 | 0 |
| 1991 | 33 | 0 |
| 1992 | 25 | 0 |
| 1993 | 18 | 0 |
| 1994 | 37 | 0 |
| 1995 | 34 | 0 |
| 1996 | 40 | 0 |
| 1997 | 36 | 0 |
| 1998 | 52 | 0 |
| 1999 | 51 | 0 |
| 2000 | 56 | 0 |
| 2001 | 80 | 33 |
| 2002 | 121 | 133 |
| 2003 | 127 | 162 |
| 2004 | 143 | 164 |
| 2005 | 133 | 194 |
| 2006 | 142 | 208 |
| 2007 | 145 | 226 |
| 2008 | 149 | 188 |
| 2009 | 132 | 237 |
| 2010 | 133 | 185 |
| 2011 | 173 | 199 |
| 2012 | 194 | 209 |
| 2013 | 172 | 225 |
| 2014 | 184 | 268 |
| 2015 | 226 | 273 |
| 2016 | 243 | 221 |
| 2017 | 260 | 255 |
| 2018 | 249 | 270 |
| 2019 | 281 | 325 |
| 2020 | 309 | 352 |
| 2021 | 259 | 328 |
| 2022 | 301 | 335 |
| 2023 | 285 | 377 |
| 2024 | 277 | 254 |
| 2025 | 305 | 264 |
| 2026 | 158 | 286 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H05K 1/0243Printed circuits associated with mounted high frequency components1,611
- H05K 1/025Impedance arrangements1,588
- H05K 1/0245Lay-out of balanced signal pairs995
- H05K 1/024Dielectric details860
- H05K 1/0242Structural details of individual signal conductors318
- H05K 1/0239Signal transmission by ac coupling275
- H05K 1/0248Skew reduction or using delay lines240
- H05K 1/0246Termination of transmission lines173
Recent patents
- Printed circuit board to dielectric waveguide interface6 Oct 2026US 12,756,084 B1Northrop Grumman Systems Corporation
- Ground connection for automotive shielded cables6 Oct 2026US 12,756,119 B1Infineon Technologies Americas Corp.
- Circuit board6 Oct 2026US 12,757,320 B2Chipbond Technology Corporation
- Wiring board, electronic component storage package, and electronic device6 Oct 2026US 12,757,324 B2KYOCERA Corporation
- Buried skip vias for improved signal and power integrity6 Oct 2026US 12,757,327 B2NVIDIA Corporation
- Optical receiver8 Oct 2026US 2026/0312695 A1Nippon Telegraph and Telephone Corporation
- Earphone8 Oct 2026US 2026/0313283 A1Vivo Mobile Communication Co., Ltd.
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Overlapped interconnect with enhanced design1 Oct 2026US 2026/0304601 A1Micron Technology, Inc.
- Electronic control unit1 Oct 2026US 2026/0304715 A1Kubota Corporation
Most cited
By later US patents
- Memory system having synchronous-link DRAM (SLDRAM) devices and controller383US 6,442,644 B1Advanced Memory International, Inc. · 2002
- Low-cost accelerometer370US 6,336,365 B12002
- Circuit structure including a passive element formed within a grid array substrate and method for making the same370US 6,362,525 B1Cypress Semiconductor Corporation · 2002
- Microwave IC package307US 5,294,897 AMitsubishi Denki Kabushiki Kaisha · 1994
- Apparatus for interconnecting multiple devices on a circuit board247US 6,434,016 B1Intel Corporation · 2002