H05K 1/0243
Printed circuits associated with mounted high frequency components
Official title: {Printed circuits associated with mounted high frequency components}
H05K1/0243 (Printed circuits associated with mounted high frequency components) appears on 1,611 US grants and 1,768 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,611
- Published applications
- 1,768
- Assignees
- 655
- Inventors
- 3,767
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 2 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 2 | 0 |
| 1982 | 1 | 0 |
| 1983 | 0 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 4 | 0 |
| 1987 | 3 | 0 |
| 1988 | 3 | 0 |
| 1989 | 6 | 0 |
| 1990 | 2 | 0 |
| 1991 | 6 | 0 |
| 1992 | 4 | 0 |
| 1993 | 4 | 0 |
| 1994 | 5 | 0 |
| 1995 | 4 | 0 |
| 1996 | 11 | 0 |
| 1997 | 6 | 0 |
| 1998 | 9 | 0 |
| 1999 | 11 | 0 |
| 2000 | 20 | 0 |
| 2001 | 24 | 4 |
| 2002 | 17 | 13 |
| 2003 | 14 | 40 |
| 2004 | 21 | 19 |
| 2005 | 24 | 33 |
| 2006 | 23 | 38 |
| 2007 | 31 | 47 |
| 2008 | 36 | 42 |
| 2009 | 28 | 53 |
| 2010 | 27 | 29 |
| 2011 | 37 | 39 |
| 2012 | 32 | 47 |
| 2013 | 38 | 64 |
| 2014 | 55 | 67 |
| 2015 | 58 | 72 |
| 2016 | 63 | 60 |
| 2017 | 64 | 81 |
| 2018 | 83 | 88 |
| 2019 | 84 | 125 |
| 2020 | 133 | 157 |
| 2021 | 103 | 132 |
| 2022 | 124 | 116 |
| 2023 | 86 | 127 |
| 2024 | 109 | 92 |
| 2025 | 131 | 104 |
| 2026 | 57 | 79 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Carrier substrate, a method, and an electronic assembly22 Sep 2026US 12,745,343 B2Telefonaktiebolaget LM Ericsson (publ)
- Coupler and electronic device15 Sep 2026US 12,738,625 B2Huawei Technologies Co., Ltd.
- Radio frequency front-end module15 Sep 2026US 12,738,907 B2RadRock (Chongqing) Tech Co., Ltd.
- Multilayer dielectric substrate and method for manufacturing multilayer dielectric substrate15 Sep 2026US 12,739,968 B2Murata Manufacturing Co., Ltd.
- Bridge coupling to surface emitters8 Sep 2026US 12,733,090 B2Credo Technology Group Limited
- Optical receiver8 Oct 2026US 2026/0312695 A1Nippon Telegraph and Telephone Corporation
- Earphone8 Oct 2026US 2026/0313283 A1Vivo Mobile Communication Co., Ltd.
- High Voltage Pulse Generator for High-Energy Beam Kickers24 Sep 2026US 2026/0290670 A1EHT Ventures LLC
- Power receiving device24 Sep 2026US 2026/0291285 A1Toyoda Gosei Co., Ltd.
- Metal card including insert coil and method of manufacturing same17 Sep 2026US 2026/0282209 A1Kona M Co., Ltd.
Most cited
By later US patents
- Method and system for controlling radio frequency radiation in microelectronic packages using heat dissipation structures237US 6,282,095 B1Compaq Computer Corporation · 2001
- Low cost millimeter wave imager236US 7,583,074 B1HRL Laboratories, LLC · 2009
- System and method for payload enclosure218US 8,786,514 B2Redline Communications Inc. · 2014
- Strip line circuit component and method of manufacture170US 4,821,007 ATektronix, Inc. · 1989
- Shielded antenna in a semiconductor package148US 6,770,955 B1Skyworks Solutions, Inc. · 2004