Bridge coupling to surface emitters
AssigneeCredo Technology Group Limited
InventorXike Liu
Life of this patent
Estimating the term…
Abstract
Techniques are provided for reducing crosstalk between bond wires coupling high frequency signals to multiple transducers in an integrated circuit (IC) chip. At least some of the techniques employ a bridge element configured to be bottom mounted to a printed circuit board next to a surface emitter chip. The bridge element may include: device contacts to each be bond wire connected to a respective anode contact of the surface emitter chip; board contacts to each be bond wire connected to a respective signal trace of the printed circuit board; and a signal path for each of the device contacts, the signal path connecting that device contact to a respective one of the board contacts without active amplification.
Claims20
A printed circuit board assembly that comprises:
- a printed circuit board having signal traces;
- a surface emitter chip bottom-mounted to the printed circuit board and having an array of photoemitter devices with associated anode contacts;
- and
- a passive bridge element bottom-mounted to the printed circuit board next to the surface emitter chip, the passive bridge element having:
- device contacts each bond wire connected to a respective one of the anode contacts;
- board contacts each bond wire connected to a respective one of the printed circuit board signal traces;
- and
- for each device contact, a signal path connecting that device contact to a respective one of the board contacts without active amplification.
A bridge element configured to be bottom mounted to a printed circuit board next to a surface emitter chip, the bridge element comprising:
- device contacts to each be bond wire connected to a respective anode contact of the surface emitter chip;
- board contacts to each be bond wire connected to a respective signal trace of the printed circuit board;
- and
- a signal path for each of the device contacts, the signal path connecting that device contact to a respective one of the board contacts without active amplification.
A cable connector that comprises:
- an optical coupling module that optically couples optical fibers to an array of photoemitters on a surface emitter chip bottom-mounted to a printed circuit board, the surface emitter chip having anode contacts for the photoemitters in the array;
- and
- a passive bridge element bottom-mounted to the printed circuit board next to the surface emitter chip, the passive bridge element having:
- device contacts each bond wire connected to a respective one of the anode contacts;
- board contacts each bond wire connected to a respective signal trace on the printed circuit board;
- and
- for each device contact, a signal path connecting that device contact to a respective one of the board contacts without active amplification.
Dependencies are inferred from the claim text.