Radio frequency front-end module

An RF front-end module, comprising:

• a substrate, and a first RF chip, a second RF chip, a first switch chip and a second switch chip arranged on the substrate, wherein the first RF chip comprises a first RF amplifier circuit, and the second RF chip comprises a second RF amplifier circuit and a third RF amplifier circuit;
• the first RF amplifier circuit outputs RF signals via the first switch chip, the second RF amplifier circuit outputs RF signals via the first switch chip, and the third RF amplifier circuit outputs RF signals via the second switch chip;
• wherein
• the RF front-end module further comprises a second matching module and a third matching module;
• the RF signals output by the second RF amplifier circuit is transmitted to the first switch chip through the second matching module, the second matching module is arranged between the third side of the second RF chip and the third side of the substrate, and both the third side of the second RF chip and the third side of the substrate are arranged along a second direction;
• the RF signals output by the third RF amplifier circuit is transmitted to the second switch chip through the third matching module, and the third matching module is arranged between a second side of the second RF chip and a second side of the substrate, and both the second side of the second RF chip and the second side of the substrate are arranged along a first direction;
• and
• the first direction and the second direction intersect.

An RF front-end module, comprising:

• a substrate, and a first RF chip, a second RF chip, a first switch chip and a second switch chip arranged on the substrate, wherein the first RF chip comprises a first RF amplifier circuit, and the second RF chip comprises a second RF amplifier circuit and a third RF amplifier circuit;
• the first RF amplifier circuit outputs RF signals via the first switch chip, the second RF amplifier circuit outputs RF signals via the first switch chip, and the third RF amplifier circuit outputs RF signals via the second switch chip;
• wherein the RF front-end module further comprises a first matching module and a second matching module, and the RF signals output by the first RF amplifier circuit is transmitted to the first switch chip through the first matching module, the first matching module is arranged between the first RF chip and the first switch chip;
• the RF signals output by the second RF amplifier circuit is transmitted to the first switch chip through the second matching module, the second matching module is arranged between the third side of the second RF chip and the third side of the substrate, and the third side of the second RF chip and the third side of the substrate are both arranged along a second direction.

An RF front-end module, comprising:

• a substrate, and a second RF chip, a second matching module, a third matching module, a first switch chip and a second switch chip arranged on the substrate;
• the second RF chip comprises a second RF amplifier circuit and a third RF amplifier circuit;
• RF signals output by the second RF amplifier circuit is transmitted to the first switch chip through the second matching module, the second matching module is arranged between a third side of the second RF chip and a third side of the substrate, and both the third side of the second RF chip and the third side of the substrate are arranged along a second direction;
• and
• RF signals output by the third RF amplifier circuit is transmitted to the second switch chip through the third matching module, and the third matching module is arranged between a second side of the second RF chip and a second side of the substrate, and both the second side of the second RF chip and the second side of the substrate are arranged along a first direction;
• and the first direction and the second direction intersect.