H05K 1/0245
Lay-out of balanced signal pairs
Official title: {Lay-out of balanced signal pairs, e.g. differential lines or twisted lines}
H05K1/0245 (Lay-out of balanced signal pairs) appears on 995 US grants and 1,198 published applications in this corpus.
Search patents in H05K- Granted patents
- 995
- Published applications
- 1,198
- Assignees
- 395
- Inventors
- 1,827
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 1 | 0 |
| 1993 | 0 | 0 |
| 1994 | 2 | 0 |
| 1995 | 4 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 2 | 0 |
| 2000 | 1 | 0 |
| 2001 | 4 | 1 |
| 2002 | 5 | 5 |
| 2003 | 7 | 7 |
| 2004 | 7 | 16 |
| 2005 | 9 | 15 |
| 2006 | 15 | 23 |
| 2007 | 14 | 26 |
| 2008 | 22 | 20 |
| 2009 | 16 | 43 |
| 2010 | 21 | 39 |
| 2011 | 41 | 44 |
| 2012 | 45 | 58 |
| 2013 | 37 | 50 |
| 2014 | 42 | 64 |
| 2015 | 54 | 54 |
| 2016 | 56 | 47 |
| 2017 | 61 | 73 |
| 2018 | 61 | 56 |
| 2019 | 89 | 62 |
| 2020 | 67 | 73 |
| 2021 | 55 | 47 |
| 2022 | 53 | 69 |
| 2023 | 64 | 73 |
| 2024 | 37 | 39 |
| 2025 | 60 | 58 |
| 2026 | 34 | 136 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Wiring board, electronic component storage package, and electronic device6 Oct 2026US 12,757,324 B2KYOCERA Corporation
- Transition structures for ultrahigh speed digital signal transmission, and digital transmission line including same22 Sep 2026US 12,744,300 B2Kyungpook National University Industry-Academic Cooperation Foundation
- Core resonance suppression in signal integrity optimized package15 Sep 2026US 12,739,967 B2Avago Technologies International Sales Pte. Limited
- Collapse-free circuit structure with low capacitance effect15 Sep 2026US 12,739,969 B2Unimicron Technology Corp.
- Differential pair impedance matching for a printed circuit board18 Aug 2026US 12,713,519 B2Jabil Inc.
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Circuit board device24 Sep 2026US 2026/0292971 A1Global Unichip Corporation
- Printed circuit board hardware interface with reduced crosstalk20 Aug 2026US 2026/0247522 A1Microsoft Technology Licensing, LLC
- Printed wiring board13 Aug 2026US 2026/0239536 A1Sumitomo Electric Industries, Ltd.
- Simultaneous Silicon Spring and Chip Singulation DRIE13 Aug 2026US 2026/0239987 A1
Most cited
By later US patents
- Microstrip arrangement220US 6,266,016 B1Telefonaktiebolaget LM Ericsson (publ) · 2001
- Disk drive comprising stacked and stepped traces for improved transmission line performance165US 8,289,656 B1Western Digital Technologies, Inc. · 2012
- Crosstalk cancellation and/or reduction148US 9,293,798 B2Intel Corporation · 2016
- Disk drive comprising an interconnect with transmission lines forming an approximated lattice network134US 8,467,151 B1Western Digital Technologies, Inc. · 2013
- Magnetic disk drive having a suspension mounted transmission line including read and write conductors and a lower conductor121US 7,319,573 B2Hitachi Global Storage Technologies Japan, Ltd. · 2008