H05K 1/0242
Structural details of individual signal conductors
Official title: {Structural details of individual signal conductors, e.g. related to the skin effect}
H05K1/0242 (Structural details of individual signal conductors) appears on 318 US grants and 373 published applications in this corpus.
Search patents in H05K- Granted patents
- 318
- Published applications
- 373
- Assignees
- 196
- Inventors
- 817
- Latest grant
- 8 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 1 | 0 |
| 1990 | 0 | 0 |
| 1991 | 3 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 3 |
| 2002 | 4 | 2 |
| 2003 | 4 | 4 |
| 2004 | 3 | 3 |
| 2005 | 4 | 9 |
| 2006 | 3 | 4 |
| 2007 | 5 | 3 |
| 2008 | 4 | 2 |
| 2009 | 1 | 2 |
| 2010 | 1 | 5 |
| 2011 | 1 | 4 |
| 2012 | 8 | 11 |
| 2013 | 5 | 18 |
| 2014 | 10 | 12 |
| 2015 | 15 | 30 |
| 2016 | 15 | 14 |
| 2017 | 24 | 21 |
| 2018 | 22 | 27 |
| 2019 | 23 | 29 |
| 2020 | 29 | 31 |
| 2021 | 19 | 26 |
| 2022 | 27 | 20 |
| 2023 | 20 | 31 |
| 2024 | 17 | 17 |
| 2025 | 29 | 27 |
| 2026 | 7 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Bridge coupling to surface emitters8 Sep 2026US 12,733,090 B2Credo Technology Group Limited
- Wiring substrate4 Aug 2026US 12,701,658 B2Ibiden Co., Ltd.
- Low-transmission-loss copper-based composite material and preparation method thereof, PCB, and electronic component30 Jun 2026US 12,668,890 B2Songshan Lake Materials Laboratory
- Thermally decoupled signal transmission lines19 May 2026US 12,635,066 B2International Business Machines Corporation
- Laminate for wiring board14 Apr 2026US 12,604,416 B2Namics Corporation
- Substrate and electronic device24 Sep 2026US 2026/0292970 A1Kioxia Corporation
- Wiring board and head-mounted display17 Sep 2026US 2026/0282208 A1Dai Nippon Printing Co.Ltd.
- Multilayer substrate10 Sep 2026US 2026/0271180 A1Murata Manufacturing Co., Ltd.
- Optical module16 Jul 2026US 2026/0202633 A1Hisense Broadband Multimedia Technologies Co., Ltd.
- Systems and methods for improving high frequency transmission in printed circuit boards18 Jun 2026US 2026/0173251 A1
Most cited
By later US patents
- Self regulating temperature heater as an integral part of a printed circuit board90US 5,010,233 AAMP Incorporated · 1991
- Method for coating a dielectric ceramic piece44US 5,281,326 ALK-Products Oy · 1994
- Copper clad epoxy printed circuit board suitable for microwave frequencies encountered in GPS receivers38US 5,268,064 ATrimble Navigation Limited · 1993
- Self-soldering flexible circuit connector27US 5,175,409 AMetcal, Inc. · 1992
- Printed circuit board including pads with vacancies22US 7,238,892 B2Hewlett-Packard Development Company, L. P. · 2007