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US 7,238,892 B2Granted
Printed circuit board including pads with vacancies
AssigneeHewlett-Packard Development Company, L.P.
InventorsKarl J. Bois, David W. Quint, Michael Tsuk
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Abstract
Methods and apparatuses for affecting the frequency behavior of connections within a printed circuit board or an integrated circuit are disclosed. Some embodiments include a printed circuit board comprising, a plurality of conductive layers each comprising at least one conductive pad, where each conductive pad on the conductive layers includes a vacancy, and an insulating material disposed about the conductive layers such that the vacancies are at least partially filled with the insulating material.
Claims15
A printed circuit board (PCB), comprising:
- a plurality of conductive layers;
- each conductive layer comprising at least one conductive pad;
- each conductive pad further comprising a vacancy filled by a dielectric material:
- a cavity formed through at least two vacancies in two respective conductive pads;
- wherein the cavity is plated with a conductive material, thereby forming at least one conductive channel disposed longitudinally along the inside of the cavity to conduct a signal between the conductive pads.
2 more elements
A computer system, comprising:
- a processor;
- a system memory coupled to said processor through a PCB;, wherein the PCB comprises:
- a plurality of conductive layers;
- each conductive layer comprising at least one conductive pad;
- each conductive pad further comprising a vacancy filled by a dielectric material;
- a cavity formed through at least two vacancies in two respective conductive pads;
- wherein the cavity is plated with a conductive material, thereby forming at least one conductive channel disposed longitudinally along the inside of the cavity to conduct a signal between the conductive pads.
4 more elements
Dependencies are inferred from the claim text.