H05K 1/0239
Signal transmission by ac coupling
Official title: {Signal transmission by AC coupling}
H05K1/0239 (Signal transmission by ac coupling) appears on 275 US grants and 265 published applications in this corpus.
Search patents in H05K- Granted patents
- 275
- Published applications
- 265
- Assignees
- 148
- Inventors
- 456
- Latest grant
- 19 May 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 1 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 0 | 0 |
| 1998 | 0 | 0 |
| 1999 | 4 | 0 |
| 2000 | 1 | 0 |
| 2001 | 2 | 4 |
| 2002 | 10 | 4 |
| 2003 | 11 | 7 |
| 2004 | 5 | 6 |
| 2005 | 7 | 10 |
| 2006 | 11 | 13 |
| 2007 | 8 | 17 |
| 2008 | 7 | 4 |
| 2009 | 13 | 16 |
| 2010 | 9 | 10 |
| 2011 | 7 | 22 |
| 2012 | 21 | 18 |
| 2013 | 14 | 17 |
| 2014 | 11 | 22 |
| 2015 | 23 | 17 |
| 2016 | 18 | 17 |
| 2017 | 20 | 12 |
| 2018 | 10 | 11 |
| 2019 | 14 | 7 |
| 2020 | 9 | 6 |
| 2021 | 8 | 8 |
| 2022 | 9 | 6 |
| 2023 | 7 | 4 |
| 2024 | 4 | 4 |
| 2025 | 2 | 3 |
| 2026 | 2 | 0 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Thermally decoupled signal transmission lines19 May 2026US 12,635,066 B2International Business Machines Corporation
- Signal transmission system6 Jan 2026US 12,519,445 B2Hitachi Astemo, Ltd.
- Isolator15 Apr 2025US 12,279,362 B2Kabushiki Kaisha Toshiba
- Radio frequency front-end structures14 Jan 2025US 12,200,855 B2Intel Corporation
- Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board3 Dec 2024US 12,160,948 B2Cisco Technology, Inc.
- Thermally decoupled signal transmission lines12 Jun 2025US 2025/0193996 A1International Business Machines Corporation
- Transmission media for digital signals and electronic device13 Mar 2025US 2025/0089155 A1Autox Tech Pte. Ltd.
- Radio frequency front-end structures27 Feb 2025US 2025/0071885 A1Intel Corporation
- Signal transmission system26 Dec 2024US 2024/0429890 A1Hitachi Astemo, Ltd.
- Electronic apparatus including fpcb structure7 Nov 2024US 2024/0372935 A1Samsung Electronics Co., Ltd.
Most cited
By later US patents
- Dielectric waveguide with non-planar interface surface and mating deformable material182US 9,350,063 B2Texas Instruments Incorporated · 2016
- Disk drive comprising stacked and stepped traces for improved transmission line performance165US 8,289,656 B1Western Digital Technologies, Inc. · 2012
- High-speed digital distribution system164US 6,449,308 B1Intel Corporation · 2002
- Symbol-based signaling device for an electromagnetically-coupled bus system142US 7,075,996 B2Intel Corporation · 2006
- Method for making flexible circuit card with laser-contoured vias and machined capacitors109US 5,066,357 AHewlett-Packard Company · 1991