Radio frequency front-end structures
AssigneeIntel Corporation
InventorsSidharth Dalmia, Zhenguo Jiang, William J. Lambert, Kirthika Nahalingam, Swathi Vijayakumar
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Abstract
Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.
Claims20
A radio frequency (RF) communication assembly, comprising:
- a package substrate including a passive circuit element and a conductive interconnect, wherein the passive circuit element is embedded in the package substrate;
- a further component coupled to the package substrate;
- an insulator material over the further component;
- and
- a metal layer over the insulator material, wherein the metal layer is conductively coupled to the conductive interconnect.
A radio frequency (RF) communication assembly, comprising:
- a package substrate comprising a circuit element embedded therein;
- a further component coupled to the package substrate;
- an insulator material over the further component;
- and
- a metal layer over a top face of the insulator material and along side faces of the insulator material.
A radio frequency (RF) communication assembly, comprising:
- a substrate, wherein the substrate is a flexible substrate or the substrate includes glass;
- a circuit element embedded in the substrate;
- and
- one or more discrete components coupled to a surface of the substrate.
Dependencies are inferred from the claim text.