Radio frequency front-end structures
AssigneeIntel Corporation
InventorsSidharth Dalmia, Zhenguo Jiang, William J. Lambert, Kirthika Nahalingam, Swathi Vijayakumar
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Abstract
Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.
Claims20
A radio frequency (RF) communication assembly, comprising:
- a package substrate comprising a first layer comprising first conductive interconnects and a circuit component, wherein the circuit component is one of a capacitor, an inductor, or a balun;
- a processing device coupled to the package substrate;
- an epoxy material over the processing device;
- and
- a second layer comprising second conductive interconnects over the epoxy material, wherein one or more of the second conductive interconnects are conductively coupled to one or more of the first conductive interconnects.
A radio frequency (RF) communication assembly, comprising:
- a package substrate comprising an element embedded therein, and further comprising a layer comprising conductive interconnects, wherein at least a portion of the element is in the layer, and wherein the element is one of a capacitor, an inductor, or a balun;
- and
- a ground plane in the layer.
A radio frequency (RF) communication assembly, comprising:
- an RF package substrate comprising a metal layer and a capacitor, wherein the metal layer includes a first capacitor electrode of the capacitor;
- and
- a circuit board coupled to the RF package substrate, wherein the circuit board includes a second capacitor electrode of the capacitor.
Dependencies are inferred from the claim text.