Electronic apparatus including fpcb structure

An electronic device comprising:

• a housing;
• a first structure disposed in the housing and including a first surface facing a first direction, the first surface forming a first height of the first structure in the first direction;
• a second structure disposed in the housing and including a second surface facing the first direction, the second surface forming a second height of the second structure that is different from the first height in first direction;
• a thermally conductive layer disposed in the housing and comprising:
• a first portion at least partially overlapping, in the first direction, with the first surface of the first structure, and
• a second portion extending from the first portion and at least partially overlapping, in the first direction, with the second surface of the second structure;
• and
• an elastic layer attached to the thermally conductive layer across a boundary portion between the first surface of the first structure and the second surface of the second structure to overlap, in the first direction, with the first portion and the second portion of the thermally conductive layer.