H05K 1/025
Impedance arrangements
Official title: {Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H10W44/20)}
H05K1/025 (Impedance arrangements) appears on 1,588 US grants and 1,813 published applications in this corpus.
Search patents in H05K- Granted patents
- 1,588
- Published applications
- 1,813
- Assignees
- 593
- Inventors
- 3,069
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 3 | 0 |
| 1986 | 0 | 0 |
| 1987 | 2 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 1 | 0 |
| 1992 | 4 | 0 |
| 1993 | 3 | 0 |
| 1994 | 7 | 0 |
| 1995 | 1 | 0 |
| 1996 | 2 | 0 |
| 1997 | 4 | 0 |
| 1998 | 8 | 0 |
| 1999 | 9 | 0 |
| 2000 | 7 | 0 |
| 2001 | 16 | 10 |
| 2002 | 21 | 20 |
| 2003 | 21 | 19 |
| 2004 | 19 | 27 |
| 2005 | 16 | 30 |
| 2006 | 26 | 48 |
| 2007 | 24 | 42 |
| 2008 | 35 | 46 |
| 2009 | 22 | 53 |
| 2010 | 31 | 66 |
| 2011 | 43 | 80 |
| 2012 | 63 | 80 |
| 2013 | 69 | 99 |
| 2014 | 72 | 115 |
| 2015 | 99 | 123 |
| 2016 | 99 | 91 |
| 2017 | 112 | 77 |
| 2018 | 96 | 76 |
| 2019 | 102 | 116 |
| 2020 | 106 | 105 |
| 2021 | 74 | 92 |
| 2022 | 82 | 72 |
| 2023 | 81 | 123 |
| 2024 | 75 | 64 |
| 2025 | 85 | 78 |
| 2026 | 43 | 61 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Circuit board6 Oct 2026US 12,757,320 B2Chipbond Technology Corporation
- Buried skip vias for improved signal and power integrity6 Oct 2026US 12,757,327 B2NVIDIA Corporation
- Method for manufacturing circuit board29 Sep 2026US 12,750,948 B2Mitsui Kinzoku Company, Limited
- Core resonance suppression in signal integrity optimized package15 Sep 2026US 12,739,967 B2Avago Technologies International Sales Pte. Limited
- Collapse-free circuit structure with low capacitance effect15 Sep 2026US 12,739,969 B2Unimicron Technology Corp.
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Overlapped interconnect with enhanced design1 Oct 2026US 2026/0304601 A1Micron Technology, Inc.
- High-speed transmission board wiring structure20 Aug 2026US 2026/0247523 A1Astemo, Ltd.
- Apparatus, system, and method of a printed circuit board (pcb) to waveguide transition13 Aug 2026US 2026/0237878 A1Mobileye Vision Technologies Ltd.
- Compact wideband pcb bandpass filter using mushroom-shaped resonators13 Aug 2026US 2026/0239526 A1Viettel Group
Most cited
By later US patents
- Circuit structure including a passive element formed within a grid array substrate and method for making the same370US 6,362,525 B1Cypress Semiconductor Corporation · 2002
- Multi-layer circuit substrate having orthogonal grid ground and power planes188US 6,184,477 B2KYOCERA Corporation · 2001
- Filter structures for integrated circuit interfaces173US 6,208,225 B1FormFactor, Inc. · 2001
- Disk drive comprising stacked and stepped traces for improved transmission line performance165US 8,289,656 B1Western Digital Technologies, Inc. · 2012
- Multilayer wiring structure for attaining high-speed signal propagation143US 5,633,479 AKabushiki Kaisha Toshiba · 1997