H05K 1/0251
Related to vias or transitions between vias and transmission lines
Official title: {related to vias or transitions between vias and transmission lines}
H05K1/0251 (Related to vias or transitions between vias and transmission lines) appears on 628 US grants and 752 published applications in this corpus.
Search patents in H05K- Granted patents
- 628
- Published applications
- 752
- Assignees
- 303
- Inventors
- 1,369
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 1 | 0 |
| 2001 | 1 | 2 |
| 2002 | 9 | 3 |
| 2003 | 3 | 5 |
| 2004 | 3 | 12 |
| 2005 | 6 | 12 |
| 2006 | 14 | 20 |
| 2007 | 6 | 10 |
| 2008 | 17 | 14 |
| 2009 | 4 | 15 |
| 2010 | 12 | 23 |
| 2011 | 13 | 28 |
| 2012 | 22 | 33 |
| 2013 | 24 | 44 |
| 2014 | 24 | 41 |
| 2015 | 43 | 49 |
| 2016 | 39 | 41 |
| 2017 | 47 | 33 |
| 2018 | 44 | 34 |
| 2019 | 53 | 59 |
| 2020 | 47 | 48 |
| 2021 | 32 | 29 |
| 2022 | 27 | 32 |
| 2023 | 38 | 63 |
| 2024 | 34 | 34 |
| 2025 | 40 | 39 |
| 2026 | 23 | 29 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Buried skip vias for improved signal and power integrity6 Oct 2026US 12,757,327 B2NVIDIA Corporation
- Collapse-free circuit structure with low capacitance effect15 Sep 2026US 12,739,969 B2Unimicron Technology Corp.
- Ground shield contact member1 Sep 2026US 12,725,985 B2TE Connectivity Solutions GmbH
- Mating backplane for high speed, high density electrical connector25 Aug 2026US 12,720,680 B2Amphenol Corporation
- Matching circuit board and semiconductor device28 Jul 2026US 12,696,380 B2Sumitomo Electric Device Innovations, Inc.
- Apparatus, system, and method of a printed circuit board (pcb) to waveguide transition13 Aug 2026US 2026/0237878 A1Mobileye Vision Technologies Ltd.
- Compact wideband pcb bandpass filter using mushroom-shaped resonators13 Aug 2026US 2026/0239526 A1Viettel Group
- Printed wiring board13 Aug 2026US 2026/0239536 A1Sumitomo Electric Industries, Ltd.
- Electronic module and electronic device6 Aug 2026US 2026/0231320 A1Canon Kabushiki Kaisha
- Wiring board, electronic component mounting substrate including wiring board, and electronic module6 Aug 2026US 2026/0231323 A1KYOCERA Corporation
Most cited
By later US patents
- Backplane for radio frequency signals134US 6,392,160 B1Lucent Technologies Inc. · 2002
- Printed circuit board for RF connector mounting119US 9,022,806 B2Amphenol Corporation · 2015
- High performance connector contact structure113US 9,225,085 B2Amphenol Corporation · 2015
- High frequency printed circuit board via98US 6,538,538 B2FormFactor, Inc. · 2003
- Impedance matching stripline transition for microwave signals91US 4,494,083 ATelefonaktiebolaget L M Ericsson · 1985