H05K 1/024
Dielectric details
Official title: {Dielectric details, e.g. changing the dielectric material around a transmission line}
H05K1/024 (Dielectric details) appears on 860 US grants and 971 published applications in this corpus.
Search patents in H05K- Granted patents
- 860
- Published applications
- 971
- Assignees
- 446
- Inventors
- 2,084
- Latest grant
- 15 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1979 | 1 | 0 |
| 1980 | 1 | 0 |
| 1981 | 0 | 0 |
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 4 | 0 |
| 1986 | 2 | 0 |
| 1987 | 3 | 0 |
| 1988 | 4 | 0 |
| 1989 | 6 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 2 | 0 |
| 1993 | 1 | 0 |
| 1994 | 6 | 0 |
| 1995 | 5 | 0 |
| 1996 | 4 | 0 |
| 1997 | 3 | 0 |
| 1998 | 9 | 0 |
| 1999 | 6 | 0 |
| 2000 | 7 | 0 |
| 2001 | 16 | 5 |
| 2002 | 23 | 31 |
| 2003 | 21 | 27 |
| 2004 | 35 | 51 |
| 2005 | 27 | 47 |
| 2006 | 26 | 34 |
| 2007 | 24 | 34 |
| 2008 | 27 | 31 |
| 2009 | 12 | 38 |
| 2010 | 23 | 25 |
| 2011 | 26 | 27 |
| 2012 | 19 | 20 |
| 2013 | 23 | 27 |
| 2014 | 17 | 43 |
| 2015 | 33 | 37 |
| 2016 | 41 | 28 |
| 2017 | 34 | 37 |
| 2018 | 30 | 55 |
| 2019 | 51 | 54 |
| 2020 | 42 | 44 |
| 2021 | 36 | 46 |
| 2022 | 40 | 64 |
| 2023 | 46 | 58 |
| 2024 | 48 | 36 |
| 2025 | 40 | 40 |
| 2026 | 26 | 32 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Collapse-free circuit structure with low capacitance effect15 Sep 2026US 12,739,969 B2Unimicron Technology Corp.
- Multilayer substrate including insulating layers, signal conductive layers and ground layers and having through holes extending along intersecting directions18 Aug 2026US 12,712,246 B2Murata Manufacturing Co., Ltd.
- Glass substrate for high-frequency device and circuit board for high-frequency device11 Aug 2026US 12,703,657 B2AGC Inc.
- Magnetic ceramic substrate, substrate manufacturing method, and circulator11 Aug 2026US 12,707,561 B2Mitsubishi Electric Corporation
- Microelectronic device package with integral waveguide transition4 Aug 2026US 12,700,655 B2Texas Instruments Incorporated
- Stepped trace design for impedance compensation of high-speed differential pair channels8 Oct 2026US 2026/0313784 A1Advanced Micro Devices, Inc.
- Multilayer substrate10 Sep 2026US 2026/0271180 A1Murata Manufacturing Co., Ltd.
- Resin composition, cured product in which resin composition is used, prepreg, printed wiring board, and electronic component for high frequencies3 Sep 2026US 2026/0258240 A1Namics Corporation
- High-frequency substrate27 Aug 2026US 2026/0255470 A1Sumitomo Electric Printed Circuits, Inc.
- Printed circuit board and preparation method thereof, and electronic communication device20 Aug 2026US 2026/0247524 A1Huawei Technologies Co., Ltd.
Most cited
By later US patents
- Three-dimensional microwave circuit carrier and integral waveguide coupler226US 5,045,820 AMotorola, Inc. · 1991
- Microstrip arrangement220US 6,266,016 B1Telefonaktiebolaget LM Ericsson (publ) · 2001
- Dielectric waveguide with non-planar interface surface and mating deformable material182US 9,350,063 B2Texas Instruments Incorporated · 2016
- Voltage tunable laminated dielectric materials for microwave applications171US 6,377,142 B1Paratek Microwave, Inc. · 2002
- Distributed constant circuit board using ceramic substrate material148US 5,232,765 ANGK Insulators, Ltd. · 1993