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US 2026/0258240 A1Published application
Resin composition, cured product in which resin composition is used, prepreg, printed wiring board, and electronic component for high frequencies
AssigneeNamics Corporation
InventorsMasaki YOSHIDA, Tsuyoshi KUROKAWA
Life of this patent
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Abstract
Provided is a resin composition excellent in high frequency characteristics and heat resistance reliability. The resin composition includes: (A) a polyphenylene ether resin having a functional group containing a carbon-carbon double bond at a terminal; and (B) a compound having an isocyanuric ring structure and two allyl groups in one molecule and being liquid at 25° C. (in the formula (1), R1 represents a hydrogen atom or an alkyl group).
Claims20
A resin composition comprising:
- (A) a polyphenylene ether resin having a group represented by a formula (1) below at a terminal;
- and
- (B) a compound having an isocyanuric ring structure and two allyl groups in one molecule and being liquid at 25° C.,
- (in the formula (1), R1 represents a hydrogen atom or an alkyl group).
1 more element
Dependencies are inferred from the claim text.