H01J 37/32623
Mechanical discharge control means
Official title: {Mechanical discharge control means}
H01J37/32623 (Mechanical discharge control means) appears on 2,179 US grants and 2,894 published applications in this corpus.
Search patents in H01J- Granted patents
- 2,179
- Published applications
- 2,894
- Assignees
- 469
- Inventors
- 4,977
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 3 | 0 |
| 1977 | 0 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 2 | 0 |
| 1981 | 6 | 0 |
| 1982 | 10 | 0 |
| 1983 | 8 | 0 |
| 1984 | 8 | 0 |
| 1985 | 9 | 0 |
| 1986 | 11 | 0 |
| 1987 | 16 | 0 |
| 1988 | 9 | 0 |
| 1989 | 10 | 0 |
| 1990 | 19 | 0 |
| 1991 | 11 | 0 |
| 1992 | 14 | 0 |
| 1993 | 18 | 0 |
| 1994 | 24 | 0 |
| 1995 | 21 | 0 |
| 1996 | 20 | 0 |
| 1997 | 20 | 0 |
| 1998 | 21 | 0 |
| 1999 | 32 | 0 |
| 2000 | 36 | 0 |
| 2001 | 33 | 17 |
| 2002 | 44 | 41 |
| 2003 | 42 | 71 |
| 2004 | 48 | 66 |
| 2005 | 39 | 63 |
| 2006 | 23 | 64 |
| 2007 | 20 | 71 |
| 2008 | 31 | 96 |
| 2009 | 27 | 74 |
| 2010 | 45 | 80 |
| 2011 | 50 | 72 |
| 2012 | 41 | 77 |
| 2013 | 50 | 84 |
| 2014 | 75 | 88 |
| 2015 | 73 | 112 |
| 2016 | 73 | 116 |
| 2017 | 71 | 101 |
| 2018 | 76 | 120 |
| 2019 | 75 | 135 |
| 2020 | 123 | 203 |
| 2021 | 101 | 191 |
| 2022 | 128 | 236 |
| 2023 | 110 | 201 |
| 2024 | 159 | 182 |
| 2025 | 178 | 181 |
| 2026 | 114 | 152 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Substrate processing device and method for cleaning substrate processing device6 Oct 2026US 12,753,506 B2Jusung Engineering Co., Ltd.
- Plasma processing apparatus6 Oct 2026US 12,755,937 B2Tokyo Electron Limited
- Apparatus for conducting plasma surface treatment, board treatment system having the same, and method of manufacturing semiconductor devices using the same6 Oct 2026US 12,755,942 B2New Power Plasma Co., Ltd.
- Focus ring unit and substrate processing apparatus29 Sep 2026US 12,749,659 B2Semes Co., Ltd.
- Substrate processing apparatus, method of manufacturing semiconductor device and plasma generating apparatus22 Sep 2026US 12,744,182 B2Kokusai Electric Corporation
- System and method to maintain constant clamping pressure during chamber rebooting and power failure instances8 Oct 2026US 2026/0311974 A1Lam Research Corporation
- Methods and systems for dry etching8 Oct 2026US 2026/0314324 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Auxiliary ring in substrate processing apparatus8 Oct 2026US 2026/0314327 A1Samsung Electronics Co., Ltd.
- Substrate support and substrate processing apparatus1 Oct 2026US 2026/0302141 A1Tokyo Electron Limited
- High-performance adaptable sampling system1 Oct 2026US 2026/0302145 A1Tokyo Electron Limited
Most cited
By later US patents
- Methods and apparatus for atomic layer etching577US 8,617,411 B2Lam Research Corporation · 2013
- Methods and apparatus for passivating a substrate in a plasma reactor567US 5,968,275 ALam Research Corporation · 1999
- Method and apparatus for plasma optimization in water processing562US 7,017,514 B1Novellus Systems, Inc. · 2006
- Semiconductor reaction chamber with plasma capabilities538US 9,018,111 B2ASM IP Holding B. V. · 2015
- Semiconductor reaction chamber with plasma capabilities501US 9,412,564 B2ASM IP Holding B. V. · 2016