Back to results
US 12,749,659 B2Granted
Focus ring unit and substrate processing apparatus
AssigneeSemes Co., Ltd.
InventorSu Ryong Bang
Life of this patent
Estimating the term…
Abstract
A focus ring capable of evaluating a plurality of focus ring shapes is provided. A focus ring unit, as a focus ring used in a substrate processing device includes a plurality of parts with different conditions of an exposed surface facing a plasma space in a circumferential direction.
Claims20
A focus ring unit, as a focus ring used in a substrate processing device, comprising:
- a plurality of parts with different conditions of an exposed surface facing a plasma space in a circumferential direction,
- wherein the exposed surface of each of the plurality of parts includes:
- an inclined surface having an inclination angle with respect to a radial direction of the focus ring, and
- a first surface connected to an outer end of the inclined surface in the radial direction and parallel to the radial direction, and
- wherein a condition of the exposed surface includes at least the inclination angle of the inclined surface and a height by the inclined surface,
- wherein the plurality of parts comprises a first group and a second group,
- wherein the inclination angle of the inclined surface of each part of the first group differs while the height by the inclined surface of each part of the first group remains constant,
- wherein the height by the inclined surface of each part of the second group differs while the inclination angle of the inclined surface of each part of the second group remains constant,
- wherein each part of the plurality of parts is configured to correspond to an inspection area located at an edge region of a substrate, the inspection area including a middle portion of the exposed surface of the corresponding part in the circumferential direction, and
- wherein each part of plurality of parts defines a localized plasma-facing region of the focus ring unit that is configured to interact with a distinct edge portion of the substrate.
7 more elements
A focus ring unit used in a substrate processing apparatus, comprising:
- a plurality of parts including:
- a first upper surface,
- a protrusion protruding inward in a radial direction, the protrusion including a second upper surface parallel to the radial direction,
- wherein the plurality of parts are configured to have a first angle from a center of the focus ring unit and connected to form the focus ring unit,
- the plurality of parts include a condition of an exposed surface facing a plasma space,
- the condition of the exposed surface includes at least a height between the first upper surface and the second upper surface and a length of the second upper surface
- wherein the plurality of parts comprises a first group and a second group,
- wherein the height between the first upper surface and the second upper surface of each part of the first group differs while the length of the second upper surface of each part of the first group remains constant,
- wherein the length of the second upper surface of each part of the second group differs while the height between the first upper surface and the second upper surface of each part of the second group remains constant,
- wherein each part of the plurality of parts is configured to correspond to an inspection area located at an edge region of a substrate, the inspection area including a middle portion of the exposed surface of the corresponding part in a circumferential direction, and
- wherein each part of the plurality of parts defines a localized plasma-facing region of the focus ring unit that is configured to interact with a distinct edge portion of the substrate.
8 more elements
Dependencies are inferred from the claim text.