H01J 37/32642
Focus rings
Official title: {Focus rings}
H01J37/32642 (Focus rings) appears on 871 US grants and 1,436 published applications in this corpus.
Search patents in H01J- Granted patents
- 871
- Published applications
- 1,436
- Assignees
- 142
- Inventors
- 2,279
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 4 | 0 |
| 1997 | 4 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 6 | 0 |
| 2001 | 4 | 2 |
| 2002 | 9 | 7 |
| 2003 | 8 | 17 |
| 2004 | 12 | 15 |
| 2005 | 7 | 16 |
| 2006 | 2 | 19 |
| 2007 | 5 | 21 |
| 2008 | 4 | 31 |
| 2009 | 8 | 25 |
| 2010 | 18 | 42 |
| 2011 | 18 | 28 |
| 2012 | 17 | 31 |
| 2013 | 27 | 27 |
| 2014 | 28 | 31 |
| 2015 | 29 | 42 |
| 2016 | 22 | 35 |
| 2017 | 20 | 43 |
| 2018 | 31 | 61 |
| 2019 | 35 | 74 |
| 2020 | 53 | 123 |
| 2021 | 50 | 130 |
| 2022 | 78 | 145 |
| 2023 | 69 | 139 |
| 2024 | 99 | 113 |
| 2025 | 111 | 118 |
| 2026 | 83 | 101 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Substrate processing device and method for cleaning substrate processing device6 Oct 2026US 12,753,506 B2Jusung Engineering Co., Ltd.
- Focus ring unit and substrate processing apparatus29 Sep 2026US 12,749,659 B2Semes Co., Ltd.
- High precision edge ring centering for substrate processing systems22 Sep 2026US 12,744,191 B2Lam Research Corporation
- Multiple input split ring resonator ion beam source15 Sep 2026US 12,738,456 B2FEI Company
- Focus ring, substrate processing apparatus including the same, and semiconductor fabrication method using the same15 Sep 2026US 12,738,462 B2Samsung Electronics Co., Ltd.
- System and method to maintain constant clamping pressure during chamber rebooting and power failure instances8 Oct 2026US 2026/0311974 A1Lam Research Corporation
- Methods and systems for dry etching8 Oct 2026US 2026/0314324 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Substrate support and substrate processing apparatus1 Oct 2026US 2026/0302141 A1Tokyo Electron Limited
- Precise Feedback Control of Bias Voltage Tailored Waveform for Plasma Etch Processes1 Oct 2026US 2026/0302146 A1Lam Research Corporation
- Shadow ring for substrate bond protection in plasma etch chamber17 Sep 2026US 2026/0279739 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Systems, methods and apparatus for choked flow element extraction472US 9,449,793 B2Lam Research Corporation · 2016
- Focus ring for semiconductor wafer processing in a plasma reactor469US 5,685,914 AAPPLIED Materials.Inc. · 1997
- Silicon focus ring and method for producing the same468US 6,815,352 B1Shin-Etsu Chemical Co., Ltd. · 2004
- Plasma processing apparatus347US 10,622,196 B2Tokyo Electron Limited · 2020
- Wafer lift assembly240US 6,238,513 B1International Business Machines Corporation · 2001