Wafer lift assembly
AssigneeInternational Business Machines Corporation
InventorsKimberley J. Arnold, John W. Lewis, James N. Pinto
Life of this patent
Estimating the term…
Abstract
A wafer lift assembly including an RF shunt is provided. An insulating rim is connected to a powered lift cylinder via a conductive screw. The head of the screw is recessed below a top surface of the rim. A cover is arranged over top of the rim and screw. The RF shunt is a layer of conductive material arranged between the rim and the cover.
Claims44
A plasma system comprising:
- a first insulator on a powered conductor and held thereto with a fastener;
- a second insulator covering the first insulator and the fastener;
- and
- a conductor between the first insulator and the second insulator, the conductor for reducing uneven etching of the second insulator over the fastener.
A wafer lift assembly comprising:
- a rim secured to a lift cylinder via fasteners;
- a cover over top of the rim;
- and
- a ring-shaped conductor arranged between the rim and the cover.
In a plasma etching device including a pedestal for supporting a wafer, an electrode arranged below the pedestal and a lift cylinder for moving a clamp onto and off of the wafer, an apparatus for securing the wafer to the pedestal comprising:
- a rim connected to the lift cylinder by fasteners, the clamp being held between the rim and the lift cylinder;
- a cover arranged above the rim;
- and
- a ring-shaped conductor arranged between the rim and the cover.
In a plasma etching device including a pedestal supporting a wafer, an electrode embedded in the pedestal, and a lift cylinder for moving a clamping element onto and off of the wafer, a plasma field-smoothing apparatus comprising:
- a rim connected to the lift cylinder by fasteners, the fasteners and the lift cylinder being powered;
- a cover isolating the fasteners from the plasma;
- and
- a shunt arranged to smooth the plasma over the fasteners.
Dependencies are inferred from the claim text.