H01J 37/32633
Baffles
Official title: {Baffles}
H01J37/32633 (Baffles) appears on 274 US grants and 398 published applications in this corpus.
Search patents in H01J- Granted patents
- 274
- Published applications
- 398
- Assignees
- 106
- Inventors
- 1,030
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 2 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 4 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 3 | 0 |
| 1995 | 2 | 0 |
| 1996 | 3 | 0 |
| 1997 | 2 | 0 |
| 1998 | 3 | 0 |
| 1999 | 5 | 0 |
| 2000 | 4 | 0 |
| 2001 | 5 | 1 |
| 2002 | 3 | 5 |
| 2003 | 4 | 8 |
| 2004 | 5 | 5 |
| 2005 | 4 | 10 |
| 2006 | 5 | 14 |
| 2007 | 4 | 17 |
| 2008 | 5 | 19 |
| 2009 | 4 | 11 |
| 2010 | 9 | 7 |
| 2011 | 7 | 13 |
| 2012 | 6 | 20 |
| 2013 | 7 | 20 |
| 2014 | 16 | 21 |
| 2015 | 13 | 19 |
| 2016 | 16 | 23 |
| 2017 | 9 | 12 |
| 2018 | 12 | 18 |
| 2019 | 10 | 17 |
| 2020 | 18 | 20 |
| 2021 | 11 | 26 |
| 2022 | 14 | 19 |
| 2023 | 13 | 22 |
| 2024 | 11 | 21 |
| 2025 | 21 | 12 |
| 2026 | 9 | 18 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus for conducting plasma surface treatment, board treatment system having the same, and method of manufacturing semiconductor devices using the same6 Oct 2026US 12,755,942 B2New Power Plasma Co., Ltd.
- Substrate treating apparatus and substrate treating method23 Jun 2026US 12,665,170 B2Semes Co., Ltd.
- Substrate processing chamber with plasma confinement28 Apr 2026US 12,614,701 B2APPLIED Materials.Inc.
- Plasma processing device and plasma processing method10 Mar 2026US 12,573,599 B2Tokyo Electron Limited
- Interconnect structures and methods and apparatuses for forming the same10 Mar 2026US 12,575,344 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Radio frequency (rf) choke for particle reduction and increased conductance in preclean chamber13 Aug 2026US 2026/0237606 A1APPLIED Materials.Inc.
- Trench Tip Squaring in Self-Aligned Multi-Patterning Process13 Aug 2026US 2026/0239945 A1APPLIED Materials.Inc.
- Substrate Processing Chamber with Plasma Confinement6 Aug 2026US 2026/0229466 A1APPLIED Materials.Inc.
- Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording medium16 Jul 2026US 2026/0204526 A1Kokusai Electric Corporation
- Plasma processing apparatus18 Jun 2026US 2026/0171372 A1Tokyo Electron Limited
Most cited
By later US patents
- Methods and apparatus for atomic layer etching577US 8,617,411 B2Lam Research Corporation · 2013
- Methods and apparatus for passivating a substrate in a plasma reactor567US 5,968,275 ALam Research Corporation · 1999
- Method and apparatus for plasma optimization in water processing562US 7,017,514 B1Novellus Systems, Inc. · 2006
- Method and apparatus for purging and plasma suppression in a process chamber433US 9,399,228 B2Novellus Systems, Inc. · 2016
- Vacuum trap388US 9,057,388 B2International Business Machines Corporation · 2015