H01J 2237/317
Processing objects on a microscale
H01J2237/317 (Processing objects on a microscale) appears on 4,097 US grants and 3,693 published applications in this corpus.
Search patents in H01J- Granted patents
- 4,097
- Published applications
- 3,693
- Assignees
- 715
- Inventors
- 5,393
- Latest grant
- 29 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1977 | 1 | 0 |
| 1978 | 2 | 0 |
| 1979 | 2 | 0 |
| 1980 | 1 | 0 |
| 1981 | 6 | 0 |
| 1982 | 7 | 0 |
| 1983 | 1 | 0 |
| 1984 | 8 | 0 |
| 1985 | 12 | 0 |
| 1986 | 9 | 0 |
| 1987 | 17 | 0 |
| 1988 | 10 | 0 |
| 1989 | 14 | 0 |
| 1990 | 12 | 0 |
| 1991 | 18 | 0 |
| 1992 | 44 | 0 |
| 1993 | 36 | 0 |
| 1994 | 43 | 0 |
| 1995 | 51 | 0 |
| 1996 | 51 | 0 |
| 1997 | 49 | 0 |
| 1998 | 88 | 0 |
| 1999 | 111 | 0 |
| 2000 | 110 | 0 |
| 2001 | 133 | 41 |
| 2002 | 109 | 167 |
| 2003 | 166 | 143 |
| 2004 | 147 | 168 |
| 2005 | 129 | 162 |
| 2006 | 145 | 199 |
| 2007 | 112 | 188 |
| 2008 | 149 | 164 |
| 2009 | 147 | 128 |
| 2010 | 146 | 116 |
| 2011 | 100 | 118 |
| 2012 | 125 | 160 |
| 2013 | 121 | 167 |
| 2014 | 178 | 163 |
| 2015 | 146 | 195 |
| 2016 | 178 | 171 |
| 2017 | 185 | 150 |
| 2018 | 135 | 120 |
| 2019 | 152 | 141 |
| 2020 | 146 | 146 |
| 2021 | 112 | 112 |
| 2022 | 90 | 102 |
| 2023 | 98 | 141 |
| 2024 | 94 | 126 |
| 2025 | 85 | 105 |
| 2026 | 66 | 100 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H01J 2237/3175LithographyIndexing code1,896
- H01J 2237/31701Ion implantationIndexing code1,022
- H01J 2237/3174Etching microareasIndexing code868
- H01J 2237/31749Focused ion beamIndexing code574
- H01J 2237/31732Depositing thin layers on selected microareasIndexing code147
- H01J 2237/31735Direct-write microstructuresIndexing code97
Recent patents
- End point determination by means of contrast gas29 Sep 2026US 12,748,347 B2Carl Zeiss SMT GmbH
- Method and system for analyzing three-dimensional features22 Sep 2026US 12,744,180 B2FEI Company
- Focused ion beam device8 Sep 2026US 12,731,755 B2Hitachi High-Tech Science Corporation
- Support structure of inverted lamella for tall ROI1 Sep 2026US 12,725,757 B2FEI Company
- Method of sample preparation and analysis25 Aug 2026US 12,719,012 B2FEI Company
- Semiconductor apparatus and method of operating the same8 Oct 2026US 2026/0310069 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Ion implanter and ion implantation method8 Oct 2026US 2026/0311963 A1Chongqing Advanced Silicon Technology Co., LTD
- Method for fabricating superconducting qubits by focused ion beam annealing8 Oct 2026US 2026/0314268 A1Bmstu
- Charged particle beam writing method, charged particle beam writing apparatus and computer-readable recording medium17 Sep 2026US 2026/0279724 A1NuFlare Technology, Inc.
- Non-uniform subsrate processing using a scanned spot ion beam10 Sep 2026US 2026/0269168 A1APPLIED Materials.Inc.
Most cited
By later US patents
- Position measurement apparatus and method and pattern forming apparatus and writing method551US 7,640,142 B2NuFlare Technology, Inc. · 2009
- Optical proximity correction method and apparatus293US 6,269,472 B1LSI Logic Corporation · 2001
- Methods and systems for determining a critical dimension and a thin film characteristic of a specimen248US 6,633,831 B2KLA-Tencor Technologies Corporation · 2003
- Laser stimulated high current density photoelectron generator and method of manufacture235US 4,460,831 AThermo Electron Corporation · 1984
- High yield reticle with proximity effect halos210US 6,968,527 B2Synopsys, Inc. · 2005