H01J 2237/02
Details
H01J2237/02 (Details) appears on 1,675 US grants and 1,766 published applications in this corpus.
Search patents in H01J- Granted patents
- 1,675
- Published applications
- 1,766
- Assignees
- 511
- Inventors
- 3,843
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1982 | 1 | 0 |
| 1983 | 1 | 0 |
| 1984 | 2 | 0 |
| 1985 | 2 | 0 |
| 1986 | 5 | 0 |
| 1987 | 1 | 0 |
| 1988 | 1 | 0 |
| 1989 | 3 | 0 |
| 1990 | 9 | 0 |
| 1991 | 8 | 0 |
| 1992 | 9 | 0 |
| 1993 | 18 | 0 |
| 1994 | 21 | 0 |
| 1995 | 32 | 0 |
| 1996 | 27 | 0 |
| 1997 | 28 | 0 |
| 1998 | 34 | 0 |
| 1999 | 35 | 0 |
| 2000 | 36 | 0 |
| 2001 | 35 | 9 |
| 2002 | 32 | 47 |
| 2003 | 42 | 31 |
| 2004 | 28 | 47 |
| 2005 | 31 | 61 |
| 2006 | 30 | 66 |
| 2007 | 41 | 62 |
| 2008 | 31 | 87 |
| 2009 | 53 | 76 |
| 2010 | 47 | 61 |
| 2011 | 69 | 62 |
| 2012 | 46 | 65 |
| 2013 | 61 | 70 |
| 2014 | 72 | 65 |
| 2015 | 63 | 80 |
| 2016 | 56 | 59 |
| 2017 | 67 | 76 |
| 2018 | 68 | 82 |
| 2019 | 76 | 90 |
| 2020 | 99 | 95 |
| 2021 | 68 | 62 |
| 2022 | 68 | 80 |
| 2023 | 56 | 95 |
| 2024 | 45 | 88 |
| 2025 | 61 | 89 |
| 2026 | 57 | 61 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
- H01J 2237/022Avoiding or removing foreign or contaminating particles, debris or deposits on sampleIndexing code735
- H01J 2237/0203Protection arrangementsIndexing code450
- H01J 2237/026ShieldsIndexing code266
- H01J 2237/024Moving components not otherwise provided forIndexing code220
- H01J 2237/0216Means for avoiding or correcting vibration effectsIndexing code156
- H01J 2237/028Particle trapsIndexing code44
Recent patents
- Electrostatically secured substrate support assembly6 Oct 2026US 12,755,944 B2APPLIED Materials.Inc.
- Focused ion beam apparatus and control method thereof29 Sep 2026US 12,749,647 B2Samsung Electronics Co., Ltd.
- Electrostatic chuck having extended lifetime29 Sep 2026US 12,751,248 B2APPLIED Materials.Inc.
- Chamber impedance management in a processing chamber22 Sep 2026US 12,744,185 B2APPLIED Materials.Inc.
- High precision edge ring centering for substrate processing systems22 Sep 2026US 12,744,191 B2Lam Research Corporation
- Wafer placement table8 Oct 2026US 2026/0311975 A1NGK Corporation
- Shield arrangement for electron-optical module24 Sep 2026US 2026/0290742 A1ASML Netherlands B. V.
- Cover and plasma processing apparatus24 Sep 2026US 2026/0290761 A1Tokyo Electron Limited
- Backup abatement reactor for a processing tool24 Sep 2026US 2026/0290764 A1APPLIED Materials.Inc.
- Electron emission apparatus and electronic apparatus10 Sep 2026US 2026/0269164 A1Westlake University
Most cited
By later US patents
- Particle-optical projection system1,466US 7,388,217 B2IMS Nanofabrication GmbH · 2008
- CVD Processing chamber1,003US 5,558,717 AAPPLIED Materials.Inc. · 1996
- Method for preventing contamination in a plasma process chamber558US 6,482,331 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2002
- Reactor useful for chemical vapor deposition of titanium nitride526US 6,106,625 AAPPLIED Materials.Inc. · 2000
- Substrate cleaning chamber and components488US 7,942,969 B2APPLIED Materials.Inc. · 2011