G03F 7/70466
Multiple exposures
Official title: {Multiple exposures, e.g. combination of fine and coarse exposures, double patterning or multiple exposures for printing a single feature (stitching G03F7/70475)}
G03F7/70466 (Multiple exposures) appears on 921 US grants and 917 published applications in this corpus.
Search patents in G03F- Granted patents
- 921
- Published applications
- 917
- Assignees
- 285
- Inventors
- 1,734
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 1 | 0 |
| 1985 | 0 | 0 |
| 1986 | 1 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 1 | 0 |
| 1990 | 1 | 0 |
| 1991 | 4 | 0 |
| 1992 | 3 | 0 |
| 1993 | 1 | 0 |
| 1994 | 8 | 0 |
| 1995 | 8 | 0 |
| 1996 | 9 | 0 |
| 1997 | 16 | 0 |
| 1998 | 20 | 0 |
| 1999 | 18 | 0 |
| 2000 | 15 | 0 |
| 2001 | 29 | 6 |
| 2002 | 19 | 57 |
| 2003 | 48 | 40 |
| 2004 | 32 | 47 |
| 2005 | 33 | 58 |
| 2006 | 28 | 44 |
| 2007 | 24 | 67 |
| 2008 | 27 | 55 |
| 2009 | 33 | 41 |
| 2010 | 60 | 51 |
| 2011 | 45 | 38 |
| 2012 | 49 | 47 |
| 2013 | 49 | 35 |
| 2014 | 53 | 39 |
| 2015 | 45 | 40 |
| 2016 | 32 | 33 |
| 2017 | 19 | 16 |
| 2018 | 21 | 25 |
| 2019 | 30 | 35 |
| 2020 | 38 | 24 |
| 2021 | 17 | 18 |
| 2022 | 18 | 35 |
| 2023 | 15 | 19 |
| 2024 | 15 | 14 |
| 2025 | 18 | 19 |
| 2026 | 17 | 14 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Critical dimension inspection method and semiconductor device manufacturing method using the same22 Sep 2026US 12,743,026 B2Samsung Electronics Co., Ltd.
- Edge placement with spatial light modulator writing1 Sep 2026US 12,724,352 B2Mycronic AB
- Methods of patterning a photoresist, and related patterning systems25 Aug 2026US 12,717,239 B2Liteq B.V.
- Tunable shrinkage and trim process for fabricating gratings9 Jun 2026US 12,650,379 B2Meta Platforms Technologies, LLC
- Method of forming a pattern of semiconductor device of a semiconductor device on a semiconductor substrate by using an extreme ultraviolet mask19 May 2026US 12,635,482 B2Samsung Electronics Co., Ltd.
- Manufacturing method of redistribution layer8 Oct 2026US 2026/0310094 A1Shanghai AVIC Optoelectronics Co., Ltd.
- Lithographic apparatus and associated methods10 Sep 2026US 2026/0267234 A1ASML Netherlands B. V.
- Photomask and exposure method20 Aug 2026US 2026/0244091 A1Kioxia Corporation
- System and methods of lithographic exposure to improve etch performance and yield20 Aug 2026US 2026/0244107 A1Tokyo Electron Limited
- Patterning Method Applicable in Semiconductor Processing20 Aug 2026US 2026/0244110 A1Imec Vzw
Most cited
By later US patents
- Cut-mask patterning process for fin-like field effect transistor (FinFET) device3,286US 9,236,267 B2Taiwan Semiconductor Manufacturing Company.Ltd · 2016
- Making and testing an integrated circuit using high density probe points307US 5,103,557 A1992
- Method and apparatus for extending spatial frequencies in photolithography images288US 6,042,998 AUniversity of New Mexico · 2000
- Method of customizing integrated circuits by selective secondary deposition of layer interconnect material255US 5,885,749 AClear Logic, Inc. · 1999
- Method of making a flexible tester surface for testing integrated circuits253US 5,020,219 A1991