G03F 7/0392
The macromolecular compound being present in a chemically amplified positive photoresist composition
Official title: {the macromolecular compound being present in a chemically amplified positive photoresist composition}
G03F7/0392 (The macromolecular compound being present in a chemically amplified positive photoresist composition) appears on 3,630 US grants and 5,065 published applications in this corpus.
Search patents in G03F- Granted patents
- 3,630
- Published applications
- 5,065
- Assignees
- 403
- Inventors
- 3,397
- Latest grant
- 22 Sep 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 0 | 0 |
| 1978 | 0 | 0 |
| 1979 | 0 | 0 |
| 1980 | 0 | 0 |
| 1981 | 0 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 0 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 0 | 0 |
| 1989 | 0 | 0 |
| 1990 | 0 | 0 |
| 1991 | 0 | 0 |
| 1992 | 0 | 0 |
| 1993 | 0 | 0 |
| 1994 | 1 | 0 |
| 1995 | 2 | 0 |
| 1996 | 5 | 0 |
| 1997 | 0 | 0 |
| 1998 | 1 | 0 |
| 1999 | 5 | 0 |
| 2000 | 9 | 0 |
| 2001 | 26 | 21 |
| 2002 | 80 | 178 |
| 2003 | 99 | 233 |
| 2004 | 174 | 191 |
| 2005 | 127 | 203 |
| 2006 | 128 | 193 |
| 2007 | 146 | 173 |
| 2008 | 121 | 185 |
| 2009 | 143 | 240 |
| 2010 | 143 | 240 |
| 2011 | 174 | 214 |
| 2012 | 166 | 278 |
| 2013 | 191 | 266 |
| 2014 | 265 | 196 |
| 2015 | 274 | 202 |
| 2016 | 212 | 229 |
| 2017 | 177 | 163 |
| 2018 | 141 | 136 |
| 2019 | 119 | 161 |
| 2020 | 91 | 159 |
| 2021 | 97 | 178 |
| 2022 | 98 | 179 |
| 2023 | 135 | 217 |
| 2024 | 97 | 204 |
| 2025 | 100 | 225 |
| 2026 | 82 | 201 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Critical dimension inspection method and semiconductor device manufacturing method using the same22 Sep 2026US 12,743,026 B2Samsung Electronics Co., Ltd.
- Hybrid method of forming microstructure array molds, methods of making microstructure arrays, and methods of use15 Sep 2026US 12,734,730 B2Panther Life Sciences Corporation
- Compound, (co)polymer, composition, method for forming pattern, and method for producing compound15 Sep 2026US 12,735,382 B2Mitsubishi Gas Chemical Company, Inc.
- Resist composition and method for forming resist pattern15 Sep 2026US 12,736,875 B2Tokyo Ohka Kogyo.Co., Ltd.
- Bismaleimide compound, composition containing same, polybenzoxazole, and semiconductor device15 Sep 2026US 12,736,879 B2Nippon Kayaku Kabushiki Kaisha
- Onium salt monomer, polymer, chemically amplified resist composition, and pattern forming process8 Oct 2026US 2026/0310075 A1Shin-Etsu Chemical Co., Ltd.
- Resist composition, resist pattern formation method, compound, and polymer compound8 Oct 2026US 2026/0310077 A1Tokyo Ohka Kogyo.Co., Ltd.
- Resist composition and resist pattern formation method1 Oct 2026US 2026/0299410 A1Tokyo Ohka Kogyo.Co., Ltd.
- Resist composition, resist pattern formation method, compound and polymer compound1 Oct 2026US 2026/0299419 A1Tokyo Ohka Kogyo.Co., Ltd.
- Salt, acid generator, resin, resist composition, and method for producing resist pattern24 Sep 2026US 2026/0288002 A1Sumitomo Chemical Company, Limited
Most cited
By later US patents
- Photoresist monomers, polymers thereof and photoresist compositions containing it483US 6,514,666 B1Hyundai Electronics Industries Co., Ltd. · 2003
- Polymers for photoresist and photoresist compositions using the same474US 6,569,971 B2Hyundai Electronics Industries Co., Ltd. · 2003
- Photoresist polymer and photoresist composition containing the same471US 7,279,256 B2Hynix Semiconductor Inc. · 2007
- Photoresist polymer and photoresist composition containing the same471US 7,361,447 B2Hynix Semiconductor Inc. · 2008
- Photoresist monomers, polymers thereof, and photoresist compositions containing the same470US 6,607,868 B2Hynix Semiconductor Inc. · 2003