Photoresist monomers, polymers thereof and photoresist compositions containing it
AssigneeHyundai Electronics Industries Co., Ltd.
InventorsJae Hak Choi, Myoung Soo Kim
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Abstract
The present invention provides photoresist monomers, and photoresist polymers comprising the same. In one aspect of the present invention, the photoresist monomer of the present invention is dipropargyl malonic acid cyclic isopropylidene ester of the formula: Photoresist compositions comprising the photoresist polymers of the present invention have superior 157 nm wavelength transmittance, etching resistance, heat resistance and adhesiveness. In addition, photoresist compositions of the present invention can be developed easily in 2.38 wt % aqueous TMAH solution, and therefore are suitable for lithography processes using a 157 nm wavelength-light source for fabricating a minute circuit of a high integration semiconductor device.
Claims20
A photoresist polymer derived from a photoresist monomer comprising a compound of the formula:
- and a compound of the formula:
A process for preparing a photoresist polymer comprising the steps of admixing a metathesis catalyst and a photoresist monomer under conditions sufficient to produce said photoresist polymer, wherein said photoresist monomer comprises a compound of the formula:
- and a compound of the formula:
A photoresist composition comprising an organic solvent, a photoacid generator, and a photoresist polymer of the formula:
- wherein, the ratio of x:y is 0.01-100 mol %:0-99.99 mol %.
A process for forming a photoresist pattern comprising the steps of:
- (a) coating a photoresist composition on a substrate of semiconductor element to form a photoresist film, wherein said photoresist composition comprises an organic solvent, a photoacid generator, and a photoresist polymer of the formula:
- wherein, the ratio of x:y is 0.01-100 mol %:0.01-99.99 mol %;
- (b) exposing said photoresist film to light using a light source;
- and
- (c) developing said photoresist film.
Dependencies are inferred from the claim text.