C23C 14/358
Inductive energy
Official title: {Inductive energy}
C23C14/358 (Inductive energy) appears on 135 US grants and 112 published applications in this corpus.
Search patents in C23C- Granted patents
- 135
- Published applications
- 112
- Assignees
- 44
- Inventors
- 253
- Latest grant
- 17 Mar 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1991 | 1 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 0 | 0 |
| 1996 | 0 | 0 |
| 1997 | 0 | 0 |
| 1998 | 2 | 0 |
| 1999 | 4 | 0 |
| 2000 | 16 | 0 |
| 2001 | 19 | 3 |
| 2002 | 19 | 9 |
| 2003 | 5 | 9 |
| 2004 | 6 | 5 |
| 2005 | 7 | 12 |
| 2006 | 3 | 9 |
| 2007 | 1 | 9 |
| 2008 | 2 | 4 |
| 2009 | 3 | 3 |
| 2010 | 6 | 3 |
| 2011 | 3 | 4 |
| 2012 | 1 | 2 |
| 2013 | 4 | 2 |
| 2014 | 5 | 6 |
| 2015 | 1 | 2 |
| 2016 | 3 | 1 |
| 2017 | 1 | 1 |
| 2018 | 1 | 3 |
| 2019 | 0 | 1 |
| 2020 | 3 | 3 |
| 2021 | 2 | 2 |
| 2022 | 3 | 5 |
| 2023 | 3 | 7 |
| 2024 | 5 | 2 |
| 2025 | 2 | 4 |
| 2026 | 2 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Apparatus and method of damage mitigation and step coverage enhancement17 Mar 2026US 12,580,152 B2APPLIED Materials.Inc.
- Plasma producing apparatus17 Feb 2026US 12,555,743 B2SPTS Technologies Limited
- Method and apparatus for use in generating plasma27 May 2025US 12,315,697 B2Dyson Technology Limited
- Cathode unit for magnetron sputtering apparatus and magnetron sputtering apparatus6 May 2025US 12,293,905 B2Ulvac, Inc.
- System and method for particle control in MRAM processing24 Dec 2024US 12,176,192 B2Taiwan Semiconductor Manufacturing Company.Ltd
- Plasma producing apparatus25 Jun 2026US 2026/0182279 A1SPTS Technologies Limited
- Sacrificial liner for copper interconnect4 Sep 2025US 2025/0277312 A1APPLIED Materials.Inc.
- Apparatus and method of damage mitigation and step coverage enhancement15 May 2025US 2025/0157790 A1APPLIED Materials.Inc.
- Sputtering of high-quality superconducting thin films24 Apr 2025US 2025/0129468 A1Northrop Grumman Systems Corporation
- System and method for particle control in mram processing20 Mar 2025US 2025/0095975 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Step coverage and overhang improvement by pedestal bias voltage modulation330US 5,976,327 AAPPLIED Materials.Inc. · 1999
- Apparatus for depositing material into high aspect ratio holes273US 5,178,739 AInternational Business Machines Corporation · 1993
- Embedded plasma source for plasma density improvement266US 6,446,572 B1Tokyo Electron Limited · 2002
- Chemical vapor deposition plasma reactor having plural ion shower grids180US 7,695,590 B2APPLIED Materials.Inc. · 2010
- Apparatus for inductively-coupled-plasma-enhanced ionized physical-vapor deposition153US 6,136,165 ACVC Products, Inc. · 2000