Method and apparatus for use in generating plasma

A method of depositing a material on a substrate, the method comprising:

• generating a plasma remote from one or more sputter targets suitable for plasma sputtering using a plasma antenna having a length, by driving an electrical conductor of the plasma antenna with RF frequency current to generate plasma both at a first location and at a second location spaced apart from the first location in a direction along the length of the antenna, there being a region adjacent to the antenna between the first location and the second location at which the generation of plasma is curtailed as a result of at least one shield member,
• generating sputtered material from the one or more sputter targets using the plasma;
• and
• depositing the sputtered material onto the substrate.

A plasma antenna assembly, the assembly comprising an antenna and a housing, wherein

• the antenna has a length,
• the antenna is configured, when powered by RF frequency current, to generate plasma both at a first location and at a second location spaced apart from the first location in a direction along the length of the antenna, and
• the housing has at least one shield member which is arranged such that there is a region adjacent to the antenna between the first location and the second location at which, in use, the generation of plasma is inhibited as a result of said at least one shield member;
• wherein the at least one shield member is configured to restrict the generation of plasma at a further region that is on the opposite side of the first location from the second location, in the direction along the length of the antenna, or on the opposite side of the second location from the first location, in the direction along the length of the antenna.