C23C 14/354
Introduction of auxiliary energy into the plasma
Official title: {Introduction of auxiliary energy into the plasma}
C23C14/354 (Introduction of auxiliary energy into the plasma) appears on 323 US grants and 307 published applications in this corpus.
Search patents in C23C- Granted patents
- 323
- Published applications
- 307
- Assignees
- 154
- Inventors
- 659
- Latest grant
- 18 Aug 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1976 | 1 | 0 |
| 1977 | 1 | 0 |
| 1978 | 1 | 0 |
| 1979 | 1 | 0 |
| 1980 | 0 | 0 |
| 1981 | 1 | 0 |
| 1982 | 0 | 0 |
| 1983 | 0 | 0 |
| 1984 | 0 | 0 |
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 3 | 0 |
| 1988 | 2 | 0 |
| 1989 | 7 | 0 |
| 1990 | 3 | 0 |
| 1991 | 3 | 0 |
| 1992 | 4 | 0 |
| 1993 | 2 | 0 |
| 1994 | 5 | 0 |
| 1995 | 2 | 0 |
| 1996 | 1 | 0 |
| 1997 | 4 | 0 |
| 1998 | 5 | 0 |
| 1999 | 4 | 0 |
| 2000 | 21 | 0 |
| 2001 | 22 | 4 |
| 2002 | 25 | 16 |
| 2003 | 7 | 17 |
| 2004 | 15 | 14 |
| 2005 | 11 | 19 |
| 2006 | 4 | 19 |
| 2007 | 6 | 17 |
| 2008 | 6 | 6 |
| 2009 | 7 | 9 |
| 2010 | 11 | 11 |
| 2011 | 9 | 11 |
| 2012 | 6 | 8 |
| 2013 | 7 | 6 |
| 2014 | 10 | 18 |
| 2015 | 3 | 8 |
| 2016 | 12 | 5 |
| 2017 | 9 | 11 |
| 2018 | 5 | 10 |
| 2019 | 8 | 12 |
| 2020 | 6 | 8 |
| 2021 | 10 | 14 |
| 2022 | 12 | 23 |
| 2023 | 11 | 17 |
| 2024 | 9 | 11 |
| 2025 | 13 | 9 |
| 2026 | 7 | 4 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Subgroups
Granted patents
Recent patents
- Variable hardness nanocomposite coating18 Aug 2026US 12,709,794 B2Southwest Research Institute
- Vacuum layer deposition apparatus and method of depositing a layer on a substrate, especially on a substrate comprising indentations in the surface to be coated7 Apr 2026US 12,595,550 B2Evatec AG
- Apparatus and method of damage mitigation and step coverage enhancement17 Mar 2026US 12,580,152 B2APPLIED Materials.Inc.
- Plasma producing apparatus17 Feb 2026US 12,555,743 B2SPTS Technologies Limited
- Physical vapor deposition apparatus10 Feb 2026US 12,548,746 B2Samsung Electronics Co., Ltd.
- Plasma producing apparatus25 Jun 2026US 2026/0182279 A1SPTS Technologies Limited
- Physical vapor deposition apparatus14 May 2026US 2026/0135070 A1Samsung Electronics Co., Ltd.
- Film forming apparatus and film forming method19 Feb 2026US 2026/0049390 A1
- Physical vapor deposition apparatus19 Feb 2026US 2026/0049392 A1Taiwan Semiconductor Manufacturing Company.Ltd
- Duplex nanocomposite coating formed in a single physical vapor deposition device13 Nov 2025US 2025/0347003 A1Southwest Research Institute
Most cited
By later US patents
- Step coverage and overhang improvement by pedestal bias voltage modulation330US 5,976,327 AAPPLIED Materials.Inc. · 1999
- Apparatus for depositing material into high aspect ratio holes273US 5,178,739 AInternational Business Machines Corporation · 1993
- Embedded plasma source for plasma density improvement266US 6,446,572 B1Tokyo Electron Limited · 2002
- Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition228US 6,051,114 AAPPLIED Materials.Inc. · 2000
- Prosthesis of polymeric material coated with biocompatible carbon216US 5,370,684 ASorin Biomedica S.p.A. · 1994