C23C 14/357
Microwaves
Official title: {Microwaves, e.g. electron cyclotron resonance enhanced sputtering}
C23C14/357 (Microwaves) appears on 40 US grants and 37 published applications in this corpus.
Search patents in C23C- Granted patents
- 40
- Published applications
- 37
- Assignees
- 41
- Inventors
- 116
- Latest grant
- 25 Mar 2025
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1985 | 1 | 0 |
| 1986 | 0 | 0 |
| 1987 | 0 | 0 |
| 1988 | 2 | 0 |
| 1989 | 1 | 0 |
| 1990 | 2 | 0 |
| 1991 | 1 | 0 |
| 1992 | 0 | 0 |
| 1993 | 1 | 0 |
| 1994 | 2 | 0 |
| 1995 | 0 | 0 |
| 1996 | 1 | 0 |
| 1997 | 2 | 0 |
| 1998 | 1 | 0 |
| 1999 | 0 | 0 |
| 2000 | 2 | 0 |
| 2001 | 0 | 0 |
| 2002 | 0 | 2 |
| 2003 | 0 | 3 |
| 2004 | 1 | 2 |
| 2005 | 0 | 0 |
| 2006 | 0 | 1 |
| 2007 | 1 | 2 |
| 2008 | 0 | 0 |
| 2009 | 0 | 2 |
| 2010 | 1 | 1 |
| 2011 | 3 | 1 |
| 2012 | 1 | 1 |
| 2013 | 1 | 3 |
| 2014 | 0 | 2 |
| 2015 | 1 | 1 |
| 2016 | 4 | 0 |
| 2017 | 2 | 0 |
| 2018 | 0 | 2 |
| 2019 | 0 | 0 |
| 2020 | 0 | 2 |
| 2021 | 2 | 3 |
| 2022 | 2 | 5 |
| 2023 | 1 | 2 |
| 2024 | 1 | 1 |
| 2025 | 3 | 0 |
| 2026 | 0 | 1 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Device and method for producing layers with improved uniformity in coating systems with horizontally rotating substrate and additional plasma sources25 Mar 2025US 12,258,661 B2Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Sputtering device with microwave heating mechanism14 Jan 2025US 12,195,842 B2Beijing Naura Microelectronics Equipment Co., Ltd.
- Target and film forming apparatus14 Jan 2025US 12,198,912 B2Jsw Afty Corporation
- Target, film forming apparatus, and method of manufacturing film formation object22 Oct 2024US 12,125,690 B2Jsw Afty Corporation
- Modular microwave source with local lorentz force8 Aug 2023US 11,721,532 B2APPLIED Materials.Inc.
- Film forming apparatus and film forming method19 Feb 2026US 2026/0049390 A1
- Method for deposition of dense chromium on a substrate27 Jun 2024US 2024/0209493 A1Hydromecanique Et Frottement
- Target and film forming apparatus16 Nov 2023US 2023/0369034 A1Jsw Afty Corporation
- Device and method for producing layers with improved uniformity in coating systems with horizontally rotating substrate and additional plasma sources2 Mar 2023US 2023/0067917 A1Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Sputtering device25 Aug 2022US 2022/0267893 A1Beijing Naura Microelectronics Equipment Co., Ltd.
Most cited
By later US patents
- Use of pulsed-DC wafer bias for filling vias/trenches with metal in HDP physical vapor deposition228US 6,051,114 AAPPLIED Materials.Inc. · 2000
- Plasma deposition method and apparatus106US 4,492,620 ANippon Telegraph & Telephone Public Corporation · 1985
- Method and apparatus for filing high aspect patterns with metal94US 5,302,266 AInternational Business Machines Corporation · 1994
- Method and apparatus for microwave assisting sputtering81US 4,721,553 AHitachi, Ltd. · 1988
- Thin film forming apparatus and method78US 4,732,761 ANippon Telegraph and Telephone Corporation · 1988