Plasma deposition method and apparatus

Abstract

A plasma deposition apparatus comprising a plasma formation chamber into which a gas is introduced to produce plasma, a specimen chamber in which a specimen table is disposed for placing thereon a speciment substrate on which a thin film is to be formed, a plasma extraction window interposed between the plasma formation chamber and the specimen chamber, a target which is made of a sputtering material and is interposed between the plasma extraction window and the specimen table, a first means for extracting ions for sputtering the target from a plasma stream extracted from the plasma formation chamber to impinge against the target, and a second means for extracting the plasma stream through the plasma extraction window into the specimen chamber and for transporting the sputtered and ionized atoms to the specimen substrate period on the specimen table. A high quality thin film of various metals and metal compounds can be formed at a low temperature and a thin film is formed, while characteristics or properties of the thin film to be formed is controlled.

Dependencies are inferred from the claim text.