B81C 1/00666
Treatments for controlling internal stress or strain in mems structures
Official title: {Treatments for controlling internal stress or strain in MEMS structures}
B81C1/00666 (Treatments for controlling internal stress or strain in mems structures) appears on 237 US grants and 255 published applications in this corpus.
Search patents in B81C- Granted patents
- 237
- Published applications
- 255
- Assignees
- 149
- Inventors
- 524
- Latest grant
- 23 Jun 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1990 | 1 | 0 |
| 1991 | 0 | 0 |
| 1992 | 1 | 0 |
| 1993 | 1 | 0 |
| 1994 | 0 | 0 |
| 1995 | 1 | 0 |
| 1996 | 0 | 0 |
| 1997 | 1 | 0 |
| 1998 | 1 | 0 |
| 1999 | 3 | 0 |
| 2000 | 0 | 0 |
| 2001 | 10 | 2 |
| 2002 | 6 | 6 |
| 2003 | 9 | 9 |
| 2004 | 11 | 9 |
| 2005 | 5 | 5 |
| 2006 | 5 | 10 |
| 2007 | 4 | 8 |
| 2008 | 8 | 5 |
| 2009 | 6 | 4 |
| 2010 | 9 | 7 |
| 2011 | 4 | 14 |
| 2012 | 3 | 11 |
| 2013 | 7 | 7 |
| 2014 | 9 | 6 |
| 2015 | 11 | 11 |
| 2016 | 12 | 19 |
| 2017 | 17 | 15 |
| 2018 | 18 | 27 |
| 2019 | 18 | 12 |
| 2020 | 15 | 10 |
| 2021 | 12 | 9 |
| 2022 | 7 | 5 |
| 2023 | 6 | 10 |
| 2024 | 6 | 15 |
| 2025 | 7 | 12 |
| 2026 | 3 | 7 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Decoupling method for semiconductor device23 Jun 2026US 12,662,371 B2STMicroelectronics International N. V.
- Method for manufacturing mirror device23 Jun 2026US 12,662,373 B2Hamamatsu Photonics K.K.
- Stress isolation for integrated circuit package integration28 Apr 2026US 12,612,303 B2Analog Devices, Inc.
- Method of making mems microphone with an anchor9 Dec 2025US 12,495,260 B2Skyworks Solutions, Inc.
- Mems platform for thin film nanomechanics characterization11 Nov 2025US 12,469,673 B2Carnegie Mellon University
- Mems bridge24 Sep 2026US 2026/0290715 A1Sofant Technologies Ltd
- Method for producing a microstructural element and microstructural element10 Sep 2026US 2026/0265049 A1Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V.
- Micromechanical component for a capacitive sensor and/or actuator device16 Jul 2026US 2026/0200724 A1
- Mems device with compensation of the mechanical stress and related manufacturing process4 Jun 2026US 2026/0152384 A1STMicroelectronics International N. V.
- Piezoelectric microelectromechanical device with anchor reinforcement14 May 2026US 2026/0132016 A1QUALCOMM Incorporated
Most cited
By later US patents
- Method of manufacturing an X-ray exposure mask and device for controlling the internal stress of thin films246US 5,188,706 AKabushiki Kaisha Toshiba · 1993
- Use of silicon oxynitride as a sacrificial material for microelectromechanical devices118US 6,174,820 B1Sandia Corporation · 2001
- Method of fabrication of an infrared radiation detector and infrared detector device104US 6,194,722 B1Interuniversitair Micro-Elektronica Centrum (IMEC vzw) · 2001
- Silicon membrane with controlled stress75US 5,110,373 ANanostructures, Inc. · 1992
- Micro-electro-optical mechanical device having an implanted dopant included therein and a method of manufacture therefor74US 6,522,801 B1Agere Systems Inc. · 2003