Mems bridge

A circuit comprising a plurality of radio frequency, RF, microelectromechanical systems, MEMS, switches comprising:

• a substrate;
• a signal conductor supported on the substrate;
• ground conductors supported on the substrate on either side of the signal conductor;
• and a MEMS bridge at least one end of which is mechanically connected to the substrate by way of at least one anchor, the MEMS bridge comprising a variable capacitor region provided over the signal conductor and the ground conductors, wherein the MEMS bridge is deformable from a first position in which the variable capacitor portion is spaced from the respective signal and ground conductor(s) to a second position in which the variable capacitor region is closer to the respective signal and ground conductor(s) than in the first position by way of an electrostatic actuation force, wherein capacitances between the variable capacitance region and the signal conductor and the ground conductors are greater when the MEMS bridge is in the second position than when the MEMS bridge is in the first position, wherein the variable capacitor region comprises a first dielectric layer and a first conductive layer, the first conductive layer positioned on a surface of the first dielectric layer facing the substrate, the variable capacitor region further comprising a second dielectric layer provided between the first conductive layer and the signal conductor and the ground conductors, wherein the second dielectric layer comprises one or more pads on the signal conductor and the ground conductor, wherein the change in capacitance between the first position and the second position is dependent on dimensions of the one or more pads and wherein the circuit comprises RF MEMS switches comprising different dimensioned one or more pads so the change in capacitance between the first position and the second position of the RF MEMS switches is different.