B81C 1/0023
Packaging together an electronic processing unit die and a micromechanical structure die
Official title: {Packaging together an electronic processing unit die and a micromechanical structure die (MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261)}
B81C1/0023 (Packaging together an electronic processing unit die and a micromechanical structure die) appears on 426 US grants and 489 published applications in this corpus.
Search patents in B81C- Granted patents
- 426
- Published applications
- 489
- Assignees
- 190
- Inventors
- 822
- Latest grant
- 6 Oct 2026
Filings by year
| Year | Granted patents | Published applications |
|---|---|---|
| 1998 | 1 | 0 |
| 1999 | 1 | 0 |
| 2000 | 0 | 0 |
| 2001 | 1 | 0 |
| 2002 | 2 | 1 |
| 2003 | 2 | 4 |
| 2004 | 3 | 3 |
| 2005 | 4 | 12 |
| 2006 | 5 | 14 |
| 2007 | 12 | 22 |
| 2008 | 12 | 25 |
| 2009 | 9 | 22 |
| 2010 | 23 | 25 |
| 2011 | 24 | 20 |
| 2012 | 15 | 27 |
| 2013 | 25 | 25 |
| 2014 | 32 | 40 |
| 2015 | 23 | 40 |
| 2016 | 42 | 27 |
| 2017 | 34 | 40 |
| 2018 | 25 | 24 |
| 2019 | 41 | 28 |
| 2020 | 27 | 25 |
| 2021 | 16 | 14 |
| 2022 | 13 | 16 |
| 2023 | 13 | 6 |
| 2024 | 8 | 10 |
| 2025 | 8 | 11 |
| 2026 | 5 | 8 |
By publication year. Applications have been published since 2001. 2026 runs to 8 Oct.
Recent patents
- Multiple plated via arrays of different wire heights on a same substrate6 Oct 2026US RE51,062 E1Adeia Semiconductor Technologies LLC
- Die stacking with controlled angular alignment28 Apr 2026US 12,612,306 B2STMicroelectronics International N. V.
- Microelectromechanical systems sensor with frequency dependent input attenuator31 Mar 2026US 12,589,987 B2Knowles Electronics, LLC
- Die stacking with controlled tilt and angular alignment31 Mar 2026US 12,589,990 B2STMicroelectronics International N. V.
- Semiconductor device package and method of manufacturing the same17 Mar 2026US 12,581,954 B2Advanced Semiconductor Engineering, Inc.
- Packaging method for mems acoustic device structure, mems acoustic device packaging structure and mems chip packaging method for acoustic device8 Oct 2026US 2026/0307982 A1Hefei Smat Technology Co., Ltd.
- Micro-electro-mechanical system package20 Aug 2026US 2026/0242212 A1Vanguard International Semiconductor Corporation
- Microelectromechanical system20 Aug 2026US 2026/0242214 A1Murata Manufacturing Co., Ltd.
- Microelectromechanical system20 Aug 2026US 2026/0243799 A1Murata Manufacturing Co., Ltd.
- Semiconductor device and method of forming the same13 Aug 2026US 2026/0239881 A1Taiwan Semiconductor Manufacturing Company.Ltd
Most cited
By later US patents
- Vertically integrated MEMS structure with electronics in a hermetically sealed cavity172US 7,104,129 B2InvenSense, Inc. · 2006
- Method and system for packaging a MEMS device129US 7,184,202 B2Idc, LLC · 2007
- Silicon based condenser microphone and packaging method for the same118US 7,903,831 B2BSE Co., Ltd. · 2011
- MEMS microphone package and method thereof116US 7,829,961 B2Advanced Semiconductor Engineering, Inc. · 2010
- Electronic component having micro-electrical mechanical system100US 7,053,456 B2Kabushiki Kaisha Toshiba · 2006